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NE556V

Texas Instruments

NE556V by Texas Instruments

NE556V by Texas Instruments is a 14-terminal IC with power supplies of 5/15V. It operates b/w 0-70°C, suitable for analog waveform generation applications. The technology used is bipolar with TIN LEAD terminal finish in a rectangular package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,630 parts In-Stock

1+ parts

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3,630

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Digiode

USA . 2,516 parts In-Stock

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2,516

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 828 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

828

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 569 parts In-Stock

1+ parts

$1.500

100+ parts

-

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569

$1.500

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One Stop Electronics

USA . 1,438 parts In-Stock

1+ parts

$5.500

100+ parts

-

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1,438

$5.500

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Parana Technologies

USA . 2,315 parts In-Stock

1+ parts

$14.477

100+ parts

$1,344.385

1k+ parts

$13.029

10k+ parts

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2,315

$14.477

$1,344.385

$13.029

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DigiPath Technology Company

USA . 1,203 parts In-Stock

1+ parts

$15.941

100+ parts

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1k+ parts

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1,203

$15.941

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ChromeModa Solutions

Germany . 4,118 parts In-Stock

1+ parts

$16.266

100+ parts

$13.338

1k+ parts

-

10k+ parts

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4,118

$16.266

$13.338

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IDEA Electronic Components Group

UK . 1,500 parts In-Stock

1+ parts

$16.266

100+ parts

$15.453

1k+ parts

$14.639

10k+ parts

-

1,500

$16.266

$15.453

$14.639

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AZTECH Wire

Italy . 850 parts In-Stock

1+ parts

$18.086

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850

$18.086

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Component Stockers USA

USA . 434 parts In-Stock

1+ parts

$99.990

100+ parts

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434

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 12,471 parts In-Stock

1+ parts

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12,471

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Corphita

USA . 2,843 parts In-Stock

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2,843

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Microchip USA

USA . 456 parts In-Stock

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456

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Corohmni

South Africa . 181 parts In-Stock

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181

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Overview

Elevate your analog waveform generation capabilities with the NE556V by Texas Instruments. Crafted with precision and expertise, this product is a testament to the quality and innovation that TI is known for. Ideal for a wide range of applications, this versatile component offers unmatched value and benefits to customers looking to enhance their projects. Whether you're a seasoned professional or a hobbyist, the NE556V is a game-changer that delivers reliable performance and flexibility like no other. Upgrade your electronics arsenal today with this exceptional product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as package body material makes the product lightweight and durable, enhancing its portability and longevity.

Package Shape: RECTANGULAR

The rectangular shape allows for easy stacking or placement of multiple units, optimizing space usage in practical applications.

Power Supplies (V): 5/15

The product can operate on a wide range of power supplies, providing flexibility in different environments and applications.

No. of Terminals: 14

The 14 terminals offer multiple connectivity options, allowing for versatile integration and control in various circuit setups.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and maintenance, making it easier to incorporate the product into existing systems or setups.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in demanding conditions, increasing the product's durability and usability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to be used in a wide range of environments, from indoor to outdoor applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good conductivity and corrosion resistance, ensuring stable connections and long-term performance of the product.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in wiring configurations, enhancing the product's reliability and adaptability.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is suitable for standard commercial applications, offering a cost-effective solution for various projects.

Technology: BIPOLAR

The use of bipolar technology in the product allows for accurate waveform generation and signal control, making it ideal for precision applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies PCB mounting and soldering processes, ensuring secure connections and easy installation of the product.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch is a standard spacing size, enabling easy integration with other components and devices in various electronic setups.

Technical Specifications

Analog Waveform Generation NE556V attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

NE556V Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-087-1474, 5962010871474

NIIN

010871474

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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