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LM49100GRX/NOPB

Texas Instruments

LM49100GRX/NOPB by Texas Instruments

LM49100GRX/NOPB by Texas Instruments is an audio amplifier IC with 25 terminals, operating temperature range of -40 to 85°C, and max supply current of 7.4mA. It is a surface-mount device in a square package suitable for industrial applications requiring audio amplification in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,727 parts In-Stock

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2,727

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Digiode

USA . 664 parts In-Stock

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664

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 711 parts In-Stock

1+ parts

$2.431

100+ parts

-

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$2.928

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711

$2.431

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$2.928

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ChromeModa Solutions

Germany . 2,078 parts In-Stock

1+ parts

$2.731

100+ parts

$2.239

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2,078

$2.731

$2.239

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IDEA Electronic Components Group

UK . 478 parts In-Stock

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$2.731

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$2.458

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478

$2.731

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$2.458

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AZTECH Wire

Italy . 278 parts In-Stock

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$12.309

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278

$12.309

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One Stop Electronics

USA . 415 parts In-Stock

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$18.800

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415

$18.800

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QUARKTWIN TECHNOLOGY LTD

USA . 19,783 parts In-Stock

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Microchip USA

USA . 3,395 parts In-Stock

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3,395

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Corphita

USA . 3,065 parts In-Stock

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3,065

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DigiPath Technology Company

USA . 184 parts In-Stock

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$2.462

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184

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$2.462

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Overview

Elevate your audio experience with the LM49100GRX/NOPB by Texas Instruments. Designed with precision and expertise, this audio amplifier delivers top-notch quality and performance for all your audio and video needs. Whether you're enhancing sound in portable devices or improving audio systems, this product offers unparalleled value and benefits. Trust in Texas Instruments to provide you with a reliable and high-quality solution that will elevate your listening experience to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving in circuit board designs.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board.

General IC Type: AUDIO AMPLIFIER

Being an audio amplifier, this product is specifically designed for amplifying audio signals accurately and efficiently.

Power Supplies (V): 2.8, 3.6

Support for multiple power supply voltages gives flexibility in use and compatibility with different systems.

No. of Terminals: 25

Having 25 terminals provides flexibility in connectivity options and allows for various input/output configurations.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enables high-density mounting and improves overall signal integrity.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold environments without compromising performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and soldering during product assembly.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures efficient soldering process and prevents component damage.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260C ensures proper soldering and reliable connection to the circuit board.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this product suitable for use in harsh industrial environments where temperature fluctuations are common.

Terminal Form: BALL

The use of ball terminals allows for reliable electrical connections and ease of soldering during assembly.

Maximum Supply Current: 7.4 mA

The low maximum supply current helps in efficient power consumption and minimizes heat generation during operation.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and space-saving on the circuit board.

Technical Specifications

Audio & Video Amplifiers LM49100GRX/NOPB attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B25

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.8,3.6

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

7.4 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LM49100GRX/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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