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LM48903TLX/NOPB

Texas Instruments

LM48903TLX/NOPB by Texas Instruments

LM48903TLX/NOPB by Texas Instruments is a Class D audio amplifier with 2 functions, operating at temperatures from -40 to 85°C. It features a very thin profile grid array package with 30 terminals and requires power supplies of 1.8V and 3/5V. Ideal for audio applications requiring efficient amplification in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,962

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-

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Digiode

USA . 1,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,038

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 823 parts In-Stock

1+ parts

$0.945

100+ parts

-

1k+ parts

$1.851

10k+ parts

-

823

$0.945

-

$1.851

-

DigiPath Technology Company

USA . 1,786 parts In-Stock

1+ parts

$1.041

100+ parts

-

1k+ parts

-

10k+ parts

-

1,786

$1.041

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-

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IDEA Electronic Components Group

UK . 1,105 parts In-Stock

1+ parts

$1.062

100+ parts

-

1k+ parts

$0.956

10k+ parts

-

1,105

$1.062

-

$0.956

-

ChromeModa Solutions

Germany . 1,053 parts In-Stock

1+ parts

$1.062

100+ parts

$0.871

1k+ parts

-

10k+ parts

-

1,053

$1.062

$0.871

-

-

Microchip USA

USA . 1,814 parts In-Stock

1+ parts

$11.490

100+ parts

$11.420

1k+ parts

$11.380

10k+ parts

$11.350

1,814

$11.490

$11.420

$11.380

$11.350

One Stop Electronics

USA . 1,377 parts In-Stock

1+ parts

$13.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,377

$13.800

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-

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AZTECH Wire

Italy . 626 parts In-Stock

1+ parts

$18.764

100+ parts

-

1k+ parts

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10k+ parts

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626

$18.764

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Corphita

USA . 2,379 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,379

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Overview

Experience superior audio quality with the LM48903TLX/NOPB by Texas Instruments, a leading manufacturer in the industry. This audio amplifier offers unmatched performance and reliability, making it perfect for various applications in the audio and video industry. Whether you're looking to enhance your home entertainment system or improve the sound quality in your portable devices, this product delivers exceptional value and benefits to customers. Upgrade your audio experience today with the LM48903TLX/NOPB.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation on printed circuit boards, reducing manufacturing time and costs.

No. of Functions: 2

Having multiple functions in one component saves space on the PCB and simplifies design and assembly processes.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle during installation and rework.

General IC Type: CLASS D AUDIO AMPLIFIER

Class D audio amplifiers offer high efficiency and low power consumption, making them ideal for portable and battery-powered devices.

Power Supplies (V): 1.8, 3/5

Multiple power supply options provide flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 30

Higher number of terminals allow for more connections and functionality in a compact package.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style offers high density and reliability, suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold environments without compromising functionality.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides good conductivity and enhances solderability for robust connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and soldering on the PCB surface.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes thermal stress and ensures proper soldering of terminals during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper melting and bonding of solder joints for reliable connections.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates robustness and suitability for extended operating range in industrial settings.

Terminal Form: BALL

Ball terminal form provides multiple contact points for secure and stable connections on the PCB.

Maximum Supply Current: 19 mA

Low maximum supply current consumption helps in minimizing power consumption and extending battery life in portable devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high density packaging and space-saving design on the PCB.

Technical Specifications

Audio & Video Amplifiers LM48903TLX/NOPB attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-XBGA-B30

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA30,5X6,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3/5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

19 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LM48903TLX/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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