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LM4663MT

Texas Instruments

LM4663MT by Texas Instruments

LM4663MT by Texas Instruments is a Class D audio amplifier with 2.1W output power and 2 channels. It operates b/w -40 to 85°C, suitable for audio applications in compact devices due to its small outline package style. With surface mount capability and dual terminal position, it offers high-quality sound amplification in a space-efficient design.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,989 parts In-Stock

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Digiode

USA . 2,101 parts In-Stock

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Anansix

USA . 1,264 parts In-Stock

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Prism Electronics

USA . 13 parts In-Stock

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Parana Technologies

USA . 2,334 parts In-Stock

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$1.827

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$2.378

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$1.827

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DigiPath Technology Company

USA . 431 parts In-Stock

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$2.012

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$1.851

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431

$2.012

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ChromeModa Solutions

Germany . 6,012 parts In-Stock

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$2.053

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$1.683

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$2.053

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IDEA Electronic Components Group

UK . 402 parts In-Stock

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$2.053

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$1.848

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One Stop Electronics

USA . 596 parts In-Stock

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$2.800

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$2.800

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AZTECH Wire

Italy . 512 parts In-Stock

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$18.685

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Component Stockers USA

USA . 224 parts In-Stock

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$99.990

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Alle Elektronik GmbH

Germany . 4,972 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 1,485 parts In-Stock

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Kepictronics

USA . 850 parts In-Stock

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Metaverse IC Inc.

Canada . 331 parts In-Stock

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Perfect Parts

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Overview

Elevate your audio experience with the LM4663MT by Texas Instruments, a cutting-edge Class D audio amplifier that delivers superior sound quality and efficiency. Manufactured with precision and expertise, this amplifier is designed to enhance audio and video systems with its compact size, high performance, and wide operating temperature range. Whether you're looking to upgrade your home entertainment system or enhance your portable devices, the LM4663MT offers the perfect balance of power, reliability, and value. Experience unparalleled audio quality with Texas Instruments' innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic is a durable and lightweight material, making the amplifier easy to handle and install.

Surface Mount: YES

Surface mount technology allows for a compact and space-saving design, ideal for small electronic devices.

General IC Type: CLASS D AUDIO AMPLIFIER

Class D amplifiers are known for their efficiency and low heat dissipation, making them suitable for portable and energy-efficient devices.

Nominal Output Power: 2.1 W

This amplifier provides a decent output power for its size, suitable for driving speakers or headphones with good volume levels.

No. of Channels: 2

Having two channels allows for stereo sound output, providing a more immersive audio experience.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement allows for flexibility in power source selection, making it compatible with various devices.

Maximum Supply Voltage (Vsup): 5.5 V

The amplifier can handle a maximum supply voltage of 5.5 V, providing headroom for potential power spikes without damaging the device.

Technical Specifications

Audio & Video Amplifiers LM4663MT attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

2.1 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

LM4663MT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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