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LM4664ITLX

Texas Instruments

LM4664ITLX by Texas Instruments

Texas Instruments' LM4664ITLX is a square-shaped audio amplifier with 9 terminals. It offers 1.1W output power, 2% harmonic distortion, and 12dB gain. Ideal for industrial applications requiring compact design and high-quality audio amplification in a wide temperature range from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,880 parts In-Stock

1+ parts

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5,880

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Digiode

USA . 4,530 parts In-Stock

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4,530

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Anansix

USA . 1,163 parts In-Stock

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1,163

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 722 parts In-Stock

1+ parts

$2.928

100+ parts

-

1k+ parts

$3.427

10k+ parts

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722

$2.928

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$3.427

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DigiPath Technology Company

USA . 585 parts In-Stock

1+ parts

$3.224

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585

$3.224

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ChromeModa Solutions

Germany . 6,746 parts In-Stock

1+ parts

$3.290

100+ parts

$2.698

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6,746

$3.290

$2.698

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IDEA Electronic Components Group

UK . 624 parts In-Stock

1+ parts

$3.290

100+ parts

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$2.961

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624

$3.290

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$2.961

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AZTECH Wire

Italy . 715 parts In-Stock

1+ parts

$7.086

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715

$7.086

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One Stop Electronics

USA . 1,584 parts In-Stock

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$7.800

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1,584

$7.800

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Corphita

USA . 2,496 parts In-Stock

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2,496

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Overview

Upgrade your audio experience with the LM4664ITLX by Texas Instruments, a top-of-the-line audio amplifier that guarantees superior quality and performance. Designed by industry leader Texas Instruments, this product is perfect for a wide range of applications in audio and video systems. With its compact design and advanced features, this amplifier delivers unmatched value and benefits to customers, ensuring crystal-clear sound and optimal performance. Unleash the full potential of your audio setup with the LM4664ITLX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material makes the amplifier lightweight and durable, ideal for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy and secure installation on circuit boards, saving space and facilitating mass production.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio amplification, ensuring high-quality sound output and performance.

Nominal Output Power: 1.1 W

With a nominal output power of 1.1 W, this amplifier can deliver sufficient power to drive speakers or headphones effectively.

Harmonic Distortion: 2 %

Low harmonic distortion at 2% ensures that the amplified audio signal retains its quality without unwanted noise or distortion.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for compact design and efficient PCB layout, saving space and enabling high-density integration.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this amplifier can withstand high temperatures in industrial environments, ensuring reliable performance.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage of 2.7 V allows for versatility in power supply options while maintaining efficient operation.

Gain: 12 dB

A gain of 12 dB provides sufficient amplification to boost the audio signal to the desired level without distortion, enhancing the audio listening experience.

Technical Specifications

Audio & Video Amplifiers LM4664ITLX attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

Gain:

12 dB

Harmonic Distortion:

2 %

JESD-30 Code:

S-PBGA-B9

Length:

1.514 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1.1 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

1.514 mm

Trade Compliance

LM4664ITLX General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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