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LM4040D50IDCKRG4

Texas Instruments

LM4040D50IDCKRG4 by Texas Instruments

LM4040D50IDCKRG4 by Texas Instruments is a 5V voltage reference IC with ±1% max voltage tolerance. It operates b/w -40 to 85°C, ideal for industrial applications. This small outline package has a thin profile and dual terminal position, making it suitable for surface mount designs.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Chip Stock

USA . 17,040 parts In-Stock

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Vyrian

USA . 5,788 parts In-Stock

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Digiode

USA . 311 parts In-Stock

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Semicontronic

India . 1,054 parts In-Stock

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$3.500

100+ parts

$3.412

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$3.395

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1,054

$3.500

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$3.395

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Ampacity Inc.

Singapore . 557 parts In-Stock

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$3.500

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AZTECH Wire

Italy . 794 parts In-Stock

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$5.331

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One Stop Electronics

USA . 1,197 parts In-Stock

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$5.500

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Parana Technologies

USA . 1,497 parts In-Stock

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$6.974

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$647.645

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$6.277

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$6.974

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DigiPath Technology Company

USA . 2,070 parts In-Stock

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$7.679

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$7.065

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$7.679

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IDEA Electronic Components Group

UK . 1,978 parts In-Stock

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$7.836

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$7.052

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ChromeModa Solutions

Germany . 86 parts In-Stock

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$7.836

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$6.426

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Corphita

USA . 4,985 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,500 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 339 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the LM4040D50IDCKRG4 voltage reference. Designed for industrial applications, this two-terminal voltage reference offers a precise output voltage of 5V with a tight tolerance of 1%. With a compact small outline package and wide operating temperature range, this device is ideal for a variety of electronic systems where stability and accuracy are paramount. Trust in Texas Instruments for cutting-edge solutions that deliver exceptional performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the voltage reference, ensuring long-term reliability.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage supply for compatibility with a wide range of electronic devices.

Maximum Operating Temperature: 85 °C

Ability to operate efficiently under high temperature conditions, suitable for industrial applications.

Minimum Output Voltage: 4.95 V

Precise output voltage regulation for consistent performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides corrosion resistance and ensures stable electrical connections.

Maximum Seated Height: 1.1 mm

Low profile design for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Terminal Form: GULL WING

Allows for easy soldering onto the PCB for secure connections.

Maximum Voltage Tolerance: 1 %

Provides accurate and stable output voltage for precision electronic circuits.

Technical Specifications

Voltage References LM4040D50IDCKRG4 attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

5.05 V

Minimum Output Voltage:

4.95 V

Nominal Output Voltage:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Voltage References

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Max Voltage Temp Coef:

150 ppm/Cel

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trim or Adjustable Output (V):

NO

Maximum Voltage Tolerance:

1 %

Width (mm):

1.25 mm

Trade Compliance

LM4040D50IDCKRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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