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LM35H

Texas Instruments

LM35H by Texas Instruments

LM35H by Texas Instruments is a temperature sensor with a voltage output. It operates b/w -55 to 150°C, with linearity of 0.30°C and positive temperature coefficient. With a package body made of metal, it has 3 terminals and uses a 2-wire interface for applications requiring precise temperature measurements in various environments.

Median Price

$22.275

Lifecycle Status

Suppliers In-Stock

17

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1k+

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Texas Instruments

USA . 4,816 parts In-Stock

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Mouser Electronics

USA . 205 parts In-Stock

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Rochester

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DigiKey

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Verical

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Freelance Electronics

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Digiode

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Nova Conductors

Japan . 150 parts In-Stock

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Anansix

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DigiKey Marketplace

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Vyrian

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Chip Stock

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Cyclops Electronics Ltd

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M&R Communications

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NexGen Digital

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A2Z Electronics, Inc.

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R&J Components

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$1.613

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$1.613

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$1.697

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$1.613

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Parana Technologies

USA . 2,323 parts In-Stock

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$1.749

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$2.324

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DigiPath Technology Company

USA . 585 parts In-Stock

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$1.926

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ChromeModa Solutions

Germany . 1,822 parts In-Stock

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IDEA Electronic Components Group

UK . 1,565 parts In-Stock

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Corohmni

South Africa . 6 parts In-Stock

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Semicontronic

India . 2,047 parts In-Stock

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Ampacity Inc.

Singapore . 1,819 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Netroflash

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Modulus Dynamics

Lithuania . 700 parts In-Stock

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Lixinc

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GreenTree Electronics

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Overview

Elevate your temperature sensing capabilities with the LM35H by Texas Instruments. Renowned for its high-quality manufacturing, this analog voltage output temperature sensor offers unparalleled precision and reliability. Ideal for a wide range of applications, this sensor provides accurate temperature readings in a compact round metal package. Whether you're monitoring industrial processes or ensuring optimal performance in consumer electronics, the LM35H delivers exceptional value, benefits, and advantages to meet all your temperature sensing needs. Trust Texas Instruments for cutting-edge technology that sets the standard in temperature sensors.

Feature Benefit Bullets

Package Body Material: METAL

Metal body provides durability and protection for the temperature sensor, making it suitable for various environmental conditions.

Maximum Supply Voltage: 30 V

Ability to handle high supply voltage ensures reliable performance and safety.

Power Supplies (V): 4/30

Wide range of power supply compatibility allows for flexibility in different application scenarios.

Sensors or Transducers Type: TEMPERATURE SENSOR,ANALOG,VOLTAGE OUTPUT

Analog voltage output type sensor provides accurate temperature measurement with easy interface to analog systems.

No. of Terminals: 3

Minimal number of terminals simplifies installation and connectivity, reducing chances of wiring errors.

Body Height: 2.34 mm

Low profile design enables space-saving installation in compact systems.

Package Shape or Style: ROUND

Round shape package facilitates easy mounting and integration into circular or cylindrical structures.

Minimum Supply Voltage: 4 V

Low minimum supply voltage requirement allows for operation in energy-efficient systems.

Maximum Operating Temperature: 150 °C

High maximum operating temperature range ensures the sensor's performance in demanding temperature environments.

Minimum Operating Temperature: -55 °C

Wide temperature range enables reliable operation in extreme cold conditions.

Maximum Operating Current: 0.114 mA

Low operating current consumption results in energy-efficient operation and reduced power requirements.

Linearity °C: 0.30

High linearity indicates accurate temperature measurement across a wide range of temperatures.

Housing: METAL

Metal housing ensures durability and protection for the internal components, enhancing the sensor's longevity.

Body Length/Diameter: 5.43 mm

Compact size and shape facilitate easy integration into various systems without occupying much space.

Temperature Coef (ppm/°C): POSITIVE

Positive temperature coefficient ensures stable and accurate temperature measurements over extended periods.

Termination Type: SOLDER

Solder termination provides a secure and reliable connection for efficient signal transmission.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and integration into systems, making installation hassle-free.

Nominal R0: 0.4 ohm

Low resistance value contributes to accurate temperature sensing and reduces signal interference.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature offers secure and stable attachment to circuit boards or other surfaces.

Technical Specifications

Temperature Sensors LM35H attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

1

Body Height:

2.34 mm

Body Length/Diameter:

5.43 mm

Housing:

METAL

Linearity (Cel):

0.30

Mounting Feature:

No. of Terminals:

3

Maximum Operating Current:

.114 mA

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Body Material:

METAL

Package Equivalence Code:

CAN3/4,.1

Package Shape or Style:

Power Supplies (V):

4/30

Nominal R0:

.4 ohm

Sensors or Transducers Type:

Sub-Category:

Other Sensors/Transducers

Maximum Supply Voltage:

30 V

Minimum Supply Voltage:

4 V

Temperature Coef (ppm/Cel):

POSITIVE

Termination Type:

SOLDER

Trade Compliance

LM35H Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-415-0846, 5962014150846

NIIN

014150846

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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