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LM35CH/NOPB

Texas Instruments

LM35CH/NOPB by Texas Instruments

LM35CH/NOPB by Texas Instruments is a temperature sensor with a voltage output. It operates b/w -40 to 110°C, with linearity of 0.20°C and positive temperature coefficient. The sensor has a 3-terminal package made of metal, suitable for through-hole mounting applications.

Median Price

$12.744

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

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Element14

Singapore . 500 parts In-Stock

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$11.460

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Farnell

UK . 500 parts In-Stock

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$11.620

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$7.230

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Verical

USA . 182 parts In-Stock

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Texas Instruments

USA . 6,778 parts In-Stock

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$12.371

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$6.687

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Newark

USA . 500 parts In-Stock

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$15.250

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$9.650

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$8.560

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$15.250

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$8.560

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Mouser Electronics

USA . 12 parts In-Stock

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$16.620

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$12.900

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$11.940

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Arrow

USA . 500 parts In-Stock

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$10.187

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Nova Conductors

Japan . 100 parts In-Stock

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$11.778

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Digiode

USA . 1,688 parts In-Stock

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$12.616

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Vyrian

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Anansix

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Lakeview Electronics

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Chip Stock

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Bristol Electronics

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Atlantic Semiconductor

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Distributors (Availability)

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$1.826

100+ parts

$1.735

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$1.735

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3,000

$1.826

$1.735

$1.735

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Parana Technologies

USA . 458 parts In-Stock

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$1.857

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$2.404

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$1.857

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DigiPath Technology Company

USA . 50 parts In-Stock

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$2.044

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$1.881

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$2.044

$1.881

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ChromeModa Solutions

Germany . 1,882 parts In-Stock

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$2.086

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$1.711

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$2.086

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IDEA Electronic Components Group

UK . 224 parts In-Stock

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$2.086

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$1.877

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Corohmni

South Africa . 41 parts In-Stock

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$2.847

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Semicontronic

India . 2,157 parts In-Stock

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$11.000

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$10.725

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$10.670

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Ampacity Inc.

Singapore . 3,363 parts In-Stock

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$11.290

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Aranea Global

USA . 1,000 parts In-Stock

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$11.542

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$11.081

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Continental Prestige Electronics

USA . 6,439 parts In-Stock

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Corphita

USA . 3,072 parts In-Stock

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Modulus Dynamics

Lithuania . 93 parts In-Stock

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Lixinc

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Argo Parts USA

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Perfect Parts

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Authorized Procurement Solutions

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Robosynatics

Brazil . 900 parts In-Stock

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Lucentia Tech

USA . 900 parts In-Stock

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Overview

Experience precise and reliable temperature sensing with the LM35CH/NOPB by Texas Instruments. Crafted with high-quality materials and advanced technology, this temperature sensor provides accurate voltage output for a wide range of applications. From HVAC systems to industrial automation, the LM35CH/NOPB offers customers unmatched value and performance. Trust in Texas Instruments' reputation for excellence and enhance your projects with the LM35CH/NOPB today.

Feature Benefit Bullets

Package Body Material: METAL

Metal body provides durability and robustness, making the sensor suitable for various industrial applications.

Maximum Supply Voltage: 30 V

Ability to operate at high supply voltage levels allows for a wider range of voltage inputs without risk of damage.

Power Supplies (V): 4/30

Support for both low and high power supplies enables versatile usage in different systems.

Sensors or Transducers Type: TEMPERATURE SENSOR, ANALOG, VOLTAGE OUTPUT

Analog voltage output provides a continuous signal that can be easily interfaced with various control systems for accurate temperature monitoring.

No. of Terminals: 3

Simple three-terminal design for easy installation and connection within a circuit.

Body Height: 2.34 mm

Low profile design makes it suitable for applications with limited space constraints.

Package Shape or Style: ROUND

Round package shape allows for easy integration into circular mounting configurations.

Minimum Supply Voltage: 4 V

Low minimum supply voltage ensures the sensor can operate in systems with lower power capabilities.

Maximum Operating Temperature: 110 °C

High maximum operating temperature range allows for reliable operation in various temperature environments.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range enables usage in extreme cold environments.

Maximum Operating Current: 0.114 mA

Low operating current consumption for energy-efficient operation.

Linearity °C: 0.20

High linearity ensures accurate temperature measurements across a wide temperature range.

Housing: METAL

Metal housing provides protection against external factors, making it suitable for outdoor or harsh environment applications.

Body Length/Diameter: 5.43 mm

Compact size allows for easy integration into various systems and equipment.

Temperature Coef (ppm/°C): POSITIVE

Positive temperature coefficient ensures stability and reliability of temperature measurements over time.

Termination Type: SOLDER

Solder termination offers a secure and reliable connection for long-term usage.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with control systems.

Nominal R0: 0.4 ohm

Low nominal resistance helps in accurate temperature measurements without significant signal loss.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature provides a secure and stable installation method in various equipment.

Technical Specifications

Temperature Sensors LM35CH/NOPB attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

1

Body Height:

2.34 mm

Body Length/Diameter:

5.43 mm

Housing:

METAL

Linearity (Cel):

0.20

Mounting Feature:

No. of Terminals:

3

Maximum Operating Current:

.114 mA

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Body Material:

METAL

Package Equivalence Code:

CAN3/4,.1

Package Shape or Style:

Power Supplies (V):

4/30

Nominal R0:

.4 ohm

Sensors or Transducers Type:

Sub-Category:

Other Sensors/Transducers

Maximum Supply Voltage:

30 V

Minimum Supply Voltage:

4 V

Temperature Coef (ppm/Cel):

POSITIVE

Termination Type:

SOLDER

Trade Compliance

LM35CH/NOPB Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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