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LM34CH

Texas Instruments

LM34CH by Texas Instruments

LM34CH by Texas Instruments is a temperature sensor with voltage output. It operates b/w -40°C to 110°C, drawing a max current of 0.075 mA. Housed in a cylindrical metal package, it is ideal for through-hole mounting applications.

Median Price

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5

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1k+

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Vyrian

USA . 3,426 parts In-Stock

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Anansix

USA . 1,682 parts In-Stock

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Digiode

USA . 375 parts In-Stock

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Prism Electronics

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Resion

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Parana Technologies

USA . 927 parts In-Stock

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$2.267

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$2.767

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DigiPath Technology Company

USA . 453 parts In-Stock

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$2.496

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$2.296

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ChromeModa Solutions

Germany . 4,290 parts In-Stock

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$2.089

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IDEA Electronic Components Group

UK . 2,073 parts In-Stock

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AZTECH Wire

Italy . 579 parts In-Stock

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One Stop Electronics

USA . 713 parts In-Stock

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Alle Elektronik GmbH

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Corphita

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Overview

Discover the LM34CH by Texas Instruments, a high-quality temperature sensor that offers precise and reliable temperature measurements. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this sensor will deliver accurate results every time. Ideal for a wide range of applications, including automotive, industrial, and consumer electronics, the LM34CH provides value by offering a voltage output and easy solder termination for seamless integration into your projects. Experience the benefits of this top-of-the-line temperature sensor and elevate your designs with Texas Instruments.

Feature Benefit Bullets

Sensors or Transducers Type: TEMPERATURE SENSOR,ANALOG,VOLTAGE OUTPUT

Analog voltage output provides a continuous and precise measurement of temperature, making it suitable for applications requiring accurate temperature monitoring.

Body Height: 2.35 mm

Low profile design allows for easy integration into compact spaces or devices where space is limited.

Package Shape or Style: CYLINDRICAL

Cylindrical shape ensures easy installation and secure mounting in various applications.

Maximum Operating Temperature: 110 °C

Wide temperature range allows the sensor to be used in both low and high temperature environments, making it versatile for different applications.

Minimum Operating Temperature: -40 °C

Ability to operate in extremely low temperatures makes it suitable for applications where temperature can fluctuate significantly.

Maximum Operating Current: 0.075 mA

Low operating current minimizes power consumption, making it energy-efficient and cost-effective for continuous monitoring.

Housing: METAL

Metal housing provides durability and ensures the sensor can withstand harsh environmental conditions, increasing its reliability and longevity.

Body Length/Diameter: 5.43 mm

Compact size allows for easy placement and integration in various devices or systems.

Termination Type: SOLDER

Solder termination ensures a secure and reliable connection, reducing the risk of signal loss or interference during operation.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature provides a stable and secure installation method for the sensor, reducing the risk of movement or vibrations affecting its accuracy.

Technical Specifications

Temperature Sensors LM34CH attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Body Height:

2.35 mm

Body Length/Diameter:

5.43 mm

Housing:

METAL

Mounting Feature:

Maximum Operating Current:

.075 mA

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

Trade Compliance

LM34CH Sensors & Transducers trade compliance attributes, and parameters.

NSN

5905-01-366-1770, 5905013661770

NIIN

013661770

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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