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LM75CIM-5

Texas Instruments

LM75CIM-5 by Texas Instruments

LM75CIM-5 by Texas Instruments is a 9-bit temperature sensor with a max supply voltage of 5.5V and accuracy of 3°C. It features a 2-wire interface, operates b/w -55 to 125°C, and is commonly used in applications requiring precise temperature monitoring in compact electronic devices.

Median Price

$2.178

Lifecycle Status

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48

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Parana Technologies

USA . 1,080 parts In-Stock

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 5,346 parts In-Stock

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IDEA Electronic Components Group

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Overview

Discover the Texas Instruments LM75CIM-5, a top-of-the-line temperature sensor designed to meet your needs with precision and quality. This industry-leading product offers a wide range of applications in various industries, providing accurate temperature readings and reliable performance. With Texas Instruments' reputation for excellence, you can trust that the LM75CIM-5 delivers superior value and benefits, making it the ideal choice for your temperature sensing requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and reliable, suitable for various environments.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing flexibility in power supply options.

No. of Bits: 9

Higher number of bits allows for more precise temperature readings and accuracy.

Body Width: 3.9 inch

Compact size makes it easy to integrate into different systems without taking up much space.

Power Supplies (V): 5

Standard power supply requirement, easily accessible and widely used.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

Versatile sensor types allow for different types of temperature measurement and output options.

No. of Terminals: 8

Sufficient number of terminals for connections, providing flexibility in wiring configurations.

Body Height: 1.55 mm

Low profile design makes it suitable for applications where space is limited.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for easy placement and mounting in various orientations.

Minimum Supply Voltage: 3 V

Low minimum supply voltage requirement helps in reducing power consumption.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range for use in extreme heat conditions.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in extreme cold environments.

Maximum Operating Current: 0.28 mA

Low operating current consumption, leading to energy efficiency.

Maximum Accuracy °C: 3

High accuracy in temperature readings, ensuring reliable data for monitoring and control.

Body Length/Diameter: 4.9 mm

Compact size for easy integration and installation in various systems.

Termination Type: SOLDER

Solder termination provides secure and reliable connections for long-term use.

Output Interface Type: 2-WIRE INTERFACE

Simple and commonly used interface for easy integration with different systems.

Mounting Feature: SURFACE MOUNT

Surface mount option for easy and secure attachment to circuit boards or other surfaces.

Technical Specifications

Temperature Sensors LM75CIM-5 attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

3

Body Width:

3.9 inch

Body Height:

1.55 mm

Body Length/Diameter:

4.9 mm

Mounting Feature:

No. of Bits:

9

No. of Terminals:

8

Maximum Operating Current:

.28 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOP8,.25

Package Shape or Style:

Power Supplies (V):

5

Sub-Category:

Other Sensors/Transducers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Trade Compliance

LM75CIM-5 Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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