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LM25066IPSQE/NOPB

Texas Instruments

LM25066IPSQE/NOPB by Texas Instruments

LM25066IPSQE/NOPB by Texas Instruments is a Power Management IC with 12V nominal voltage and 500A max output current. Ideal for automotive applications, it operates b/w -40 to 125 °C and has a terminal pitch of 0.5mm. This surface mount chip carrier supports power supply circuits efficiently.

Median Price

$3.850

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 24,965 parts In-Stock

1+ parts

$4.199

100+ parts

$3.423

1k+ parts

$2.282

10k+ parts

-

24,965

$4.199

$3.423

$2.282

-

Arrow

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.501

10k+ parts

$3.228

500

-

-

$3.501

$3.228

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,353 parts In-Stock

1+ parts

$3.989

100+ parts

-

1k+ parts

-

10k+ parts

-

2,353

$3.989

-

-

-

Bristol Electronics

USA . 19 parts In-Stock

1+ parts

$6.720

100+ parts

$3.360

1k+ parts

-

10k+ parts

-

19

$6.720

$3.360

-

-

Chip Stock

USA . 38,500 parts In-Stock

1+ parts

-

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38,500

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-

-

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Vyrian

USA . 6,617 parts In-Stock

1+ parts

-

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6,617

-

-

-

-

Microfarads

USA . 18 parts In-Stock

1+ parts

-

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18

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Prism Electronics

USA . 15 parts In-Stock

1+ parts

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-

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15

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,874 parts In-Stock

1+ parts

$3.779

100+ parts

-

1k+ parts

-

10k+ parts

-

1,874

$3.779

-

-

-

AZTECH Wire

Italy . 153 parts In-Stock

1+ parts

$10.900

100+ parts

-

1k+ parts

-

10k+ parts

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153

$10.900

-

-

-

Parana Technologies

USA . 855 parts In-Stock

1+ parts

$16.521

100+ parts

-

1k+ parts

$16.806

10k+ parts

-

855

$16.521

-

$16.806

-

DigiPath Technology Company

USA . 1,082 parts In-Stock

1+ parts

$18.192

100+ parts

$16.736

1k+ parts

-

10k+ parts

-

1,082

$18.192

$16.736

-

-

ChromeModa Solutions

Germany . 1,117 parts In-Stock

1+ parts

$18.563

100+ parts

$15.222

1k+ parts

-

10k+ parts

-

1,117

$18.563

$15.222

-

-

IDEA Electronic Components Group

UK . 1,069 parts In-Stock

1+ parts

$18.563

100+ parts

$17.635

1k+ parts

$16.707

10k+ parts

-

1,069

$18.563

$17.635

$16.707

-

QUARKTWIN TECHNOLOGY LTD

USA . 8,855 parts In-Stock

1+ parts

-

100+ parts

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8,855

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A-Z Elektronik GmbH

Germany . 6,923 parts In-Stock

1+ parts

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6,923

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-

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Lixinc

USA . 6,166 parts In-Stock

1+ parts

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6,166

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-

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Alle Elektronik GmbH

Germany . 3,595 parts In-Stock

1+ parts

-

100+ parts

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3,595

-

-

-

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Futuretech Components

Singapore . 515 parts In-Stock

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515

-

-

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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500

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Kepictronics

USA . 160 parts In-Stock

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160

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S.R.D Solutions

India . 100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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100

-

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Overview

Experience unmatched quality and reliability with the LM25066IPSQE/NOPB by Texas Instruments, a leading manufacturer in the Power Management ICs category. This surface mount chip carrier offers a wide range of applications and features a very thin profile, making it perfect for automotive use. With a nominal supply voltage of 12V and maximum output current of 500A, this power supply support circuit provides customers with exceptional value and performance. Trust Texas Instruments to deliver cutting-edge technology that meets your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design makes the product easy to assemble onto circuit boards, saving time and reducing the overall size of the final product.

Nominal Supply Voltage (Vsup): 12 V

The nominal supply voltage of 12V is commonly used in many electronic systems, making this product compatible with a wide range of applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand demanding operating conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The product can operate in extreme cold conditions down to -40°C, ensuring reliability in various environments.

Width (mm): 4 mm

The compact width of 4mm makes this product suitable for space-constrained applications where size is a critical factor.

Maximum Output Current: 500 A

The high maximum output current of 500A allows this power management IC to handle high power loads effectively, making it ideal for applications requiring large amounts of power.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this power management IC meets the industry standards and requirements for use in vehicles, ensuring durability and performance under harsh automotive conditions.

Technical Specifications

Power Management ICs LM25066IPSQE/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XQCC-N24

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

500 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16X.2,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

8 mA

Maximum Supply Voltage (Vsup):

17 V

Minimum Supply Voltage (Vsup):

2.9 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LM25066IPSQE/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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