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LM1815MXEP

Texas Instruments

LM1815MXEP by Texas Instruments

LM1815MXEP by Texas Instruments is a 14-terminal analog circuit IC with a supply voltage range of 2.5V to 12V, suitable for automotive applications. It features a small outline package style, operates b/w -40°C to 125°C, and has a terminal pitch of 1.27mm for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,628 parts In-Stock

1+ parts

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4,628

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Digiode

USA . 4,467 parts In-Stock

1+ parts

-

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-

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4,467

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Anansix

USA . 947 parts In-Stock

1+ parts

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947

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 973 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

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973

$0.500

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AZTECH Wire

Italy . 429 parts In-Stock

1+ parts

$12.192

100+ parts

-

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10k+ parts

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429

$12.192

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Parana Technologies

USA . 2,284 parts In-Stock

1+ parts

$18.397

100+ parts

-

1k+ parts

$18.520

10k+ parts

-

2,284

$18.397

-

$18.520

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DigiPath Technology Company

USA . 636 parts In-Stock

1+ parts

$20.258

100+ parts

$18.637

1k+ parts

-

10k+ parts

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636

$20.258

$18.637

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ChromeModa Solutions

Germany . 4,382 parts In-Stock

1+ parts

$20.671

100+ parts

$16.950

1k+ parts

-

10k+ parts

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4,382

$20.671

$16.950

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IDEA Electronic Components Group

UK . 2,363 parts In-Stock

1+ parts

$20.671

100+ parts

$19.637

1k+ parts

$18.604

10k+ parts

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2,363

$20.671

$19.637

$18.604

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Corphita

USA . 2,075 parts In-Stock

1+ parts

-

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2,075

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Overview

Unlock the power of precise signal processing with the LM1815MXEP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that exceed expectations. This innovative semiconductor is perfect for a wide range of applications and offers unmatched performance and reliability. Trust Texas Instruments to provide cutting-edge technology that will take your projects to the next level. Elevate your designs with the LM1815MXEP and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the semiconductor components, ensuring durability and reliability.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 10 V

Suitable for a wide range of applications requiring a stable and consistent supply voltage.

No. of Terminals: 14

Offers flexibility in connecting to external circuitry and components.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, ideal for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, making it suitable for a variety of environments.

Terminal Finish: TIN LEAD

Provides good solderability and electrical conductivity for reliable connections.

Width (mm): 3.91 mm

Compact size allows for space-saving on PCBs and efficient use of board real estate.

Other IC type: ANALOG CIRCUIT

Offers analog signal processing capabilities, suitable for a wide range of sensor and control applications.

Length: 8.64 mm

Optimal length for the number of terminals and components, ensuring efficient layout and functionality.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and performance in automotive applications.

Terminal Form: GULL WING

Allows for easy and secure soldering of terminals to PCB pads, ensuring mechanical stability.

Maximum Supply Voltage (Vsup): 12 V

Capable of handling higher supply voltages for applications requiring increased power requirements.

Technical Specifications

Other Function Semiconductors LM1815MXEP attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.64 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.91 mm

Trade Compliance

LM1815MXEP Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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