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LM1819N

Texas Instruments

LM1819N by Texas Instruments

LM1819N by Texas Instruments is an industrial-grade analog circuit IC with a nominal voltage of 13.1V. Featuring a rectangular package style, it has 14 terminals with a terminal pitch of 2.54mm. This semiconductor is commonly used in applications requiring precise temperature monitoring and control in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,691 parts In-Stock

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4,691

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Digiode

USA . 3,103 parts In-Stock

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3,103

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Anansix

USA . 2,389 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 33 parts In-Stock

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LittleDiode

UK . 10 parts In-Stock

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10

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Standard Data Resources

USA . 5 parts In-Stock

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Benley Electronics

USA . 1 parts In-Stock

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$0.750

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1

$0.750

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One Stop Electronics

USA . 1,113 parts In-Stock

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$1.500

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$1.500

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Parana Technologies

USA . 886 parts In-Stock

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$11.882

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$12.279

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886

$11.882

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$12.279

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ChromeModa Solutions

Germany . 2,748 parts In-Stock

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$13.351

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$10.948

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2,748

$13.351

$10.948

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IDEA Electronic Components Group

UK . 1,353 parts In-Stock

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$13.351

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$12.683

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$12.016

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$13.351

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AZTECH Wire

Italy . 212 parts In-Stock

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$16.173

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Lixinc

USA . 9,914 parts In-Stock

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Corphita

USA . 2,451 parts In-Stock

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DigiPath Technology Company

USA . 2,095 parts In-Stock

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$12.037

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$12.037

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Kepictronics

USA . 199 parts In-Stock

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Overview

Experience the reliable performance and quality craftsmanship of Texas Instruments with the LM1819N. This versatile analog circuit semiconductor offers a wide range of applications in various industries, providing exceptional value to customers looking for precision and efficiency. With its durable plastic/epoxy package body and industrial-grade temperature rating, the LM1819N ensures consistent operation even in harsh conditions. Trust Texas Instruments for innovative solutions that deliver optimal results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the semiconductor, making it suitable for various industrial applications.

Nominal Supply Voltage (Vsup): 13.1 V

With a nominal supply voltage of 13.1V, this semiconductor can efficiently operate within a wide voltage range and is compatible with many power systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and stability even in harsh environmental conditions.

Technology: BIPOLAR

The bipolar technology used in this semiconductor offers high-speed performance and accurate signal amplification, making it ideal for analog circuit applications.

Technical Specifications

Other Function Semiconductors LM1819N attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T14

Length:

19.18 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage (Vsup):

13.1 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

LM1819N Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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