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LTC6995IS6-1#TRPBF

Analog Devices

LTC6995IS6-1#TRPBF by Analog Devices

LTC6995IS6-1#TRPBF by Analog Devices is a small outline CMOS IC with 6 terminals. It operates b/w -40 to 85°C, suitable for industrial applications. With a supply voltage range of 2.25V to 5.5V, it is ideal for analog circuit functions in various electronic devices.

Median Price

$2.638

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Arrow

USA . 2,500 parts In-Stock

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Digiode

USA . 4,772 parts In-Stock

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$5.016

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Vyrian

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Semtec, LLC

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Nova Conductors

Japan . 500 parts In-Stock

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Anansix

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MARBEL Systems

Belgium . 1,776 parts In-Stock

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Texas Native Microelectronics

USA . 877 parts In-Stock

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$1.508

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Kenton Components

USA . 3,519 parts In-Stock

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$1.945

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Vigor

Singapore . 3,229 parts In-Stock

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Semicontronic

India . 3,755 parts In-Stock

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Ampacity Inc.

Singapore . 3,690 parts In-Stock

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Qasali Group International

UK . 73 parts In-Stock

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$4.377

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$4.070

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$3.851

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Corphita

USA . 5,170 parts In-Stock

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Corohmni

South Africa . 1,011 parts In-Stock

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Parana Technologies

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IDEA Electronic Components Group

UK . 212 parts In-Stock

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$11.200

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$10.640

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DigiPath Technology Company

USA . 1,157 parts In-Stock

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$17.472

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$16.773

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Advanced Electronics

New Zealand . 15 parts In-Stock

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$19.568

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Argo Parts USA

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Continental Prestige Electronics

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Lucentia Tech

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A-Z Elektronik GmbH

Germany . 411 parts In-Stock

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Bastille Electronics

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Perfect Parts

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Overview

Discover the LTC6995IS6-1#TRPBF by Analog Devices, a cutting-edge analog circuit that delivers unparalleled performance in various applications. With a focus on quality and reliability, Analog Devices ensures that this product meets the highest industry standards. This small outline semiconductor offers customers superior value with its precise functionality and wide operating temperature range. Whether you're looking to enhance your industrial equipment or optimize your electronic designs, the LTC6995IS6-1#TRPBF is the perfect solution for your needs. Unlock the potential of your projects with this innovative semiconductor from Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package material offers good durability and protection for the semiconductor components inside.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to work with in various electronic applications.

No. of Terminals: 6

6 terminals provide the necessary connections for the functionality of the semiconductor component.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality even in extreme cold conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good conductivity and reliability for the terminal connections.

Terminal Position: DUAL

Dual terminal position offers flexibility and convenience for connecting the component in different circuit configurations.

Width (mm): 1.625 mm

Small width of 1.625mm allows for compact and space-saving designs in electronic applications.

Minimum Supply Voltage (Vsup): 2.25 V

Low minimum supply voltage requirement enables efficient power usage and operation.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliability during the soldering process.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating indicates suitability for rugged industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage support allows for versatility in different power supply configurations.

Technical Specifications

Other Function Semiconductors LTC6995IS6-1#TRPBF attributes and parameters. Explore more Other Function Semiconductors devices from Analog Devices

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.625 mm

Trade Compliance

LTC6995IS6-1#TRPBF Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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