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LM1117MPX-ADJ

Texas Instruments

LM1117MPX-ADJ by Texas Instruments

LM1117MPX-ADJ by Texas Instruments is an adjustable positive single output LDO regulator with a max output current of 0.8A and a max dropout voltage of 1.3V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.

Median Price

$0.530

Lifecycle Status

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1k+

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Rochester

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DF Sales Co.

USA . 5,968 parts In-Stock

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TEDSS.com

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Component Electronics Inc.

Canada . 1,964 parts In-Stock

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Singapore . 449 parts In-Stock

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South Africa . 73 parts In-Stock

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IDEA Electronic Components Group

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Germany . 909 parts In-Stock

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Italy . 841 parts In-Stock

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Overview

Experience superior quality and reliability with the LM1117MPX-ADJ by Texas Instruments, a leading manufacturer in adjustable regulators. This product offers exceptional value and benefits for various applications in the category of positive single output LDO regulators. With its advanced technology and precise regulation capabilities, customers can trust in the performance and efficiency of this product. Upgrade your electronics with the LM1117MPX-ADJ and enjoy the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Maximum Dropout Voltage-1: 1.3 V

With a low dropout voltage, this regulator ensures efficient power conversion.

Surface Mount: YES

The surface mount feature allows for easy and compact installation on circuit boards.

Operating Temperature (TJ-Max): 125 °C

The high operating temperature range makes this regulator suitable for various environments.

Maximum Input-Output Voltage Differential: 13.75 V

The high voltage differential capability of this regulator enhances its versatility.

No. of Functions: 1

With a single function, this regulator is straightforward and easy to use.

Technology: BIPOLAR

The bipolar technology used in this regulator ensures stable and reliable performance.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient use of board space.

Terminal Form: GULL WING

The gull wing terminal form allows for secure soldering and connection.

Operating Temperature (TJ-Min): 0 °C

The low minimum operating temperature ensures the regulator can be used in colder environments.

Packing Method: TR

The TR packing method ensures convenient storage and transportation of the regulator.

Minimum Output Voltage-1: 1.25 V

The low minimum output voltage makes this regulator suitable for powering a wide range of devices.

No. of Terminals: 4

With four terminals, this regulator offers convenient connectivity options.

Maximum Line Regulation (%/V): 0.013

The low line regulation percentage ensures stable output voltage regardless of input variations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards.

Adjustability: ADJUSTABLE

The adjustable feature allows for fine-tuning of the output voltage according to specific requirements.

Maximum Load Regulation (%): 0.4%

The low load regulation percentage ensures consistent performance under varying load conditions.

Terminal Pitch: 2.3 mm

The small terminal pitch makes it easy to integrate this regulator into compact designs.

Minimum Input-Output Voltage Differential: 1.5 V

The low minimum voltage differential requirement allows for efficient power conversion.

Regulator Type: ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

This regulator type offers precise voltage regulation for single output applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish ensures reliable solder joints for long-term use.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and connection options.

Maximum Output Voltage-1: 13.8 V

The high maximum output voltage allows for powering a wide range of devices.

Moisture Sensitivity Level (MSL): 1

The low moisture sensitivity level ensures the regulator's reliability in different environmental conditions.

Maximum Seated Height: 1.8 mm

The low seated height makes this regulator suitable for slim designs.

Width: 3.56 mm

The compact width of the regulator allows for easy integration into tight spaces.

Maximum Output Current-1: 0.8 A

The high maximum output current capability ensures the regulator can power demanding loads.

No. of Outputs: 1

With a single output, this regulator simplifies the power supply design.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the regulator can withstand soldering processes.

Nominal Dropout Voltage-1: 1.2 V

The nominal dropout voltage specification indicates the expected performance of the regulator.

Length: 6.5 mm

The compact length of the regulator contributes to its space-saving design.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO LM1117MPX-ADJ attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

1.3 V

Nominal Dropout Voltage-1:

1.2 V

Maximum Input-Output Voltage Differential:

13.75 V

Minimum Input-Output Voltage Differential:

1.5 V

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Length:

6.5 mm

Maximum Line Regulation (%/V):

.013

Maximum Load Regulation (%):

.4 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

0 Cel

Maximum Output Current-1:

.8 A

Maximum Output Voltage-1:

13.8 V

Minimum Output Voltage-1:

1.25 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.8 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Width:

3.56 mm

Trade Compliance

LM1117MPX-ADJ Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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