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LF198WG/883

Texas Instruments

LF198WG/883 by Texas Instruments

LF198WG/883 by Texas Instruments is a MIL-STD-883 compliant Sample & Hold IC with 14 terminals, operating at -55 to 125 °C. It features a max acquisition time of 25 us, peak reflow temp of 260C, and uses BIPOLAR technology. Ideal for military applications requiring fast sampling and holding capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,312 parts In-Stock

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3,312

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Anansix

USA . 2,491 parts In-Stock

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2,491

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Vyrian

USA . 2,161 parts In-Stock

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2,161

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,632 parts In-Stock

1+ parts

$6.127

100+ parts

-

1k+ parts

$6.896

10k+ parts

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1,632

$6.127

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$6.896

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One Stop Electronics

USA . 951 parts In-Stock

1+ parts

$6.410

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951

$6.410

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DigiPath Technology Company

USA . 1,617 parts In-Stock

1+ parts

$6.746

100+ parts

$6.207

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1,617

$6.746

$6.207

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ChromeModa Solutions

Germany . 1,242 parts In-Stock

1+ parts

$6.884

100+ parts

$5.645

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1,242

$6.884

$5.645

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IDEA Electronic Components Group

UK . 118 parts In-Stock

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$6.884

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$6.196

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118

$6.884

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$6.196

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AZTECH Wire

Italy . 593 parts In-Stock

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$17.929

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593

$17.929

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Corphita

USA . 2,916 parts In-Stock

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2,916

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Overview

Discover the LF198WG/883 by Texas Instruments, a top-tier Sample & Hold IC that delivers unparalleled quality and reliability. Designed with MIL-STD-883 screening level, this military-grade component boasts a ceramic, metal-sealed package body for optimal performance in extreme conditions. Ideal for a wide range of applications, this small-outline IC offers fast acquisition times and low power consumption. Trust Texas Instruments for cutting-edge technology that exceeds expectations. Elevate your projects with the LF198WG/883 and experience superior precision like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic, metal-sealed cofired package body material provides excellent protection and durability for the internal components of the sample & hold IC, making it reliable in harsh environments.

Surface Mount: YES

The surface mount capability of this sample & hold IC allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing processes.

Nominal Supply Voltage / Vsup (V): 15

The nominal supply voltage of 15V ensures stable and consistent power delivery to the sample & hold IC, improving overall performance and accuracy.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this sample & hold IC can withstand elevated temperatures without compromising its functionality, making it suitable for a wide range of applications.

Technology: BIPOLAR

The bipolar technology used in this sample & hold IC allows for high-speed and accurate sampling, ensuring precise capture and hold of analog signals for further processing.

Technical Specifications

Sample & Hold ICs LF198WG/883 attributes and parameters. Explore more Sample & Hold ICs devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Power Supply Voltage Ratings:

±15 V

Total Functions:

1

Sub-Category:

Sample and Hold Circuits

Sampling Mode:

Sample and Hold (S&H)

Performance Specifications

Nominal Acquisition Time:

20 µs

Maximum Acquisition Time:

25 µs

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-15 V

Minimum Supply Voltage:

-18 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Reflow Peak Time Limit:

40 s

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

6.5 mA

Minimum Analog Input Voltage:

-11.5 V

Maximum Analog Input Voltage:

11.5 V

Physical Characteristics

Width:

0.25 in (6.35 mm)

Maximum Seated Height:

0.102 in (2.58 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin Lead

Package Body Material:

Ceramic, Metal-Sealed Cofired

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Screening Level:

MIL-STD-883

Standards

JESD-30 Code:

R-CDSO-G14

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style (Meter):

Small Outline

Package Equivalence Code:

SOP14,.4

Trade Compliance

LF198WG/883 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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