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LF147J/NOPB

Texas Instruments

LF147J/NOPB by Texas Instruments

LF147J/NOPB by Texas Instruments is a ceramic, glass-sealed Op Amp with 8000uV input offset voltage and 100dB CMRR. Ideal for military applications, it operates b/w -55 to 125 °C with a unity gain bandwidth of 4000 kHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,185 parts In-Stock

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4,185

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Vyrian

USA . 4,011 parts In-Stock

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4,011

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Anansix

USA . 628 parts In-Stock

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628

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Distributors (Availability)

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Parana Technologies

USA . 2,317 parts In-Stock

1+ parts

$2.731

100+ parts

-

1k+ parts

$3.214

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2,317

$2.731

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$3.214

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DigiPath Technology Company

USA . 1,057 parts In-Stock

1+ parts

$3.008

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$2.767

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1,057

$3.008

$2.767

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ChromeModa Solutions

Germany . 1,390 parts In-Stock

1+ parts

$3.069

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$2.517

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1,390

$3.069

$2.517

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IDEA Electronic Components Group

UK . 842 parts In-Stock

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$3.069

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$2.762

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842

$3.069

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$2.762

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One Stop Electronics

USA . 1,446 parts In-Stock

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$8.410

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1,446

$8.410

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AZTECH Wire

Italy . 800 parts In-Stock

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$17.484

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800

$17.484

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Corphita

USA . 3,856 parts In-Stock

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3,856

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Overview

Experience top-tier performance with the LF147J/NOPB operational amplifier from Texas Instruments. Crafted with precision and expertise, this Op Amp boasts unparalleled quality and reliability. Perfect for a wide range of applications, this versatile component is designed to deliver exceptional results every time. Whether you're looking to amplify signals or perform signal processing tasks, this product offers unmatched value, benefits, and advantages that will exceed your expectations. Trust Texas Instruments to provide you with cutting-edge technology that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This package material provides durability and protection to the internal components of the op amp, ensuring long-term reliability.

Maximum Input Offset Voltage: 8000 uV

Low input offset voltage helps in minimizing errors in signal processing, making this op amp suitable for precision applications.

Nominal Common Mode Reject Ratio: 100 dB

High common mode rejection ratio indicates excellent ability to reject common-mode noise, ensuring clear and accurate output signals.

Nominal Supply Voltage: 20V

A higher supply voltage allows for flexibility in power requirements and supports a wide range of applications.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this op amp can withstand harsh environmental conditions, making it suitable for industrial and military applications.

Nominal Unity Gain Bandwidth: 4000 kHz

Higher unity gain bandwidth enables the op amp to provide stable and fast operation, making it ideal for high-frequency signal processing.

Technology: BIPOLAR

Bipolar technology offers low noise and high gain, making this op amp suitable for precision applications where accuracy is crucial.

Technical Specifications

Operational Amplifiers (Op Amps) LF147J/NOPB attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

4

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

4 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

100 dB

Input Offset Voltage Limit:

8000 uV

Nominal Slew Rate:

13 V/us

Peak Bias Current:

50 nA

Operational Characteristics

Nominal Supply Voltage:

20 V

Maximum Supply Voltage:

22 V

Maximum Negative Supply Voltage:

-20 V

Minimum Negative Supply Voltage:

-22 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Length:

0.76 in (19.304 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Total Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Ceramic, Glass-Sealed

Surface Mount:

No

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-GDIP-T14

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

In Line

Trade Compliance

LF147J/NOPB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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