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LF147D

STMicroelectronics

LF147D by STMicroelectronics

LF147D by STMicroelectronics is a 4-function operational amplifier with max input offset voltage of 13000uV and min slew rate of 12V/us. Widely used in military-grade applications due to its low-bias, high common mode rejection ratio, and voltage-feedback architecture. Package style is small outline with dual terminal position for easy installation.

Median Price

$15.834

Lifecycle Status

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12

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1k+

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Freelance Electronics

USA . 2 parts In-Stock

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American Microsemiconductor Inc.

USA . 42 parts In-Stock

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Vyrian

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Digiode

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Anansix

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Manoshevitz Elec. Sales

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Mil-Aero Solutions, Inc.

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Electronics Depot

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R&J Components

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IDEA Electronic Components Group

UK . 694 parts In-Stock

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MKK Technologies

India . 1,631 parts In-Stock

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DigiPath Technology Company

USA . 1,631 parts In-Stock

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Alle Elektronik GmbH

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Corphita

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Parana Technologies

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Overview

Get ready to experience unmatched performance and precision with the LF147D operational amplifier from STMicroelectronics. As a leader in the industry, STMicroelectronics brings you a high-quality product that is perfect for a wide range of applications. This amplifier offers exceptional value with its low-bias design, reliable operation, and military-grade temperature grade. Whether you're working on audio equipment, industrial controls, or medical devices, the LF147D delivers the power and accuracy you need to succeed. Elevate your projects with the LF147D and discover the advantages of using top-tier technology from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Maximum Input Offset Voltage: 13000 uV

The low offset voltage ensures accurate signal processing, making it suitable for precise applications.

Maximum Average Bias Current (IIB): 0.02 uA

The low bias current helps in minimizing power consumption and improving overall efficiency.

Surface Mount: YES

This feature allows for easy installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 4

With multiple functions available in a single package, this product offers versatility and cost-effectiveness.

Nominal Common Mode Reject Ratio: 86 dB

High common mode rejection ratio ensures unwanted signals are minimized, leading to clearer output signals.

Nominal Supply Voltage / Vsup (V): 15

Stable supply voltage ensures consistent performance of the operational amplifier.

Power Supplies (V): +-15

Dual power supplies allow for bipolar operation, offering flexibility in various circuit configurations.

No. of Terminals: 14

Sufficient number of terminals for connections, enabling easy integration into circuit designs.

Maximum Input Offset Current (IIO): 0.004 uA

Low input offset current ensures accurate signal processing and minimal errors in the output.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space on circuit boards, making it suitable for compact electronic devices.

Minimum Slew Rate: 12 V/us

Fast slew rate enables quick response to input signals, making it ideal for dynamic applications.

Maximum Supply Voltage Limit: 18 V

High supply voltage limit allows for a wide range of voltage inputs without damaging the operational amplifier.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures performance in extreme environments.

Maximum Bias Current (IIB) @25°C: 0.0002 uA

Low bias current at a standard temperature ensures minimal power consumption.

Frequency Compensation: YES

Frequency compensation ensures stability in amplification, preventing oscillations and improving signal fidelity.

Minimum Voltage Gain: 25000

High voltage gain amplifies weak signals effectively, making it suitable for amplification applications.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in harsh environments without compromising performance.

Terminal Finish: TIN LEAD

Tin lead finish on terminals provides good solderability and electrical conductivity for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexible connections and configurations in circuit designs.

Maximum Seated Height: 1.75 mm

Low seated height minimizes the overall profile of the component, suitable for compact electronic devices.

Width: 3.9 mm

Narrow width saves space on circuit boards and allows for dense packing of components.

Length: 8.65 mm

Compact length enables easy placement on circuit boards and reduces the overall footprint of the product.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliability in harsh operating conditions and high durability.

Low-Bias: YES

Low bias current ensures minimal power consumption and low errors in signal processing.

Maximum Negative Supply Voltage Limit: -18 V

Wide negative supply voltage limit allows for bipolar operation and flexibility in circuit designs.

Nominal Unity Gain Bandwidth: 4000 kHz

High unity gain bandwidth enables stable amplification across a wide range of frequencies.

Technology: BIPOLAR

Bipolar technology provides high accuracy and low noise in signal processing applications.

Terminal Form: GULL WING

Gull wing terminal form enables easy surface mount installation and reliable solder connections.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile and widely used in various electronic applications for signal processing and amplification.

Maximum Supply Current: 10.8 mA

Low supply current consumption ensures efficient power usage and long battery life in portable devices.

Nominal Negative Supply Voltage (Vsup): -15 V

Stable negative supply voltage enables bipolar operation and flexibility in circuit designs.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides stable amplification and high accuracy in signal processing applications.

Nominal Slow Rate: 16 V/us

High slew rate enables fast response to input signals, making it suitable for dynamic applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy connections and compatibility with standard circuit board designs.

Technical Specifications

Operational Amplifiers (Op Amps) LF147D attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

4 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

86 dB

Input Offset Voltage Limit:

13000 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

12 V/us

Nominal Slew Rate:

16 V/us

Maximum Input Offset Current (IIO):

4 nA

Peak Bias Current:

20 nA

Maximum Bias Current (IIB) @25 °C:

200 pA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

10.8 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

LF147D Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

NSN

5962-01-496-7843, 5962014967843

NIIN

014967843

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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