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ISOS141FDBQSEP

Texas Instruments

ISOS141FDBQSEP by Texas Instruments

ISOS141FDBQSEP by Texas Instruments is a 16-terminal IC with 4 functions, operating b/w -55 to 125°C. It has a supply voltage range of 2.25-5.5V and is MILITARY grade suitable for interface circuits in harsh environments. With GULL WING terminals and small outline package, it's ideal for applications requiring radiation tolerance up to 30k Rad(Si).

Median Price

$458.160

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 25,774 parts In-Stock

1+ parts

$434.826

100+ parts

$393.593

1k+ parts

$374.850

10k+ parts

-

25,774

$434.826

$393.593

$374.850

-

Arrow

USA . 65 parts In-Stock

1+ parts

$458.160

100+ parts

-

1k+ parts

-

10k+ parts

-

65

$458.160

-

-

-

Mouser Electronics

USA . 42 parts In-Stock

1+ parts

$845.140

100+ parts

-

1k+ parts

-

10k+ parts

-

42

$845.140

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,475 parts In-Stock

1+ parts

$413.085

100+ parts

-

1k+ parts

-

10k+ parts

-

3,475

$413.085

-

-

-

TME

Poland . 63 parts In-Stock

1+ parts

$786.169

100+ parts

-

1k+ parts

-

10k+ parts

-

63

$786.169

-

-

-

Vyrian

USA . 7,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,650

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 344 parts In-Stock

1+ parts

$9.368

100+ parts

-

1k+ parts

$9.990

10k+ parts

-

344

$9.368

-

$9.990

-

ChromeModa Solutions

Germany . 6,056 parts In-Stock

1+ parts

$10.526

100+ parts

$8.631

1k+ parts

-

10k+ parts

-

6,056

$10.526

$8.631

-

-

IDEA Electronic Components Group

UK . 1,316 parts In-Stock

1+ parts

$10.526

100+ parts

$10.000

1k+ parts

$9.473

10k+ parts

-

1,316

$10.526

$10.000

$9.473

-

Corphita

USA . 2,609 parts In-Stock

1+ parts

$391.343

100+ parts

-

1k+ parts

-

10k+ parts

-

2,609

$391.343

-

-

-

DigiPath Technology Company

USA . 889 parts In-Stock

1+ parts

-

100+ parts

$9.490

1k+ parts

-

10k+ parts

-

889

-

$9.490

-

-

Overview

Experience unparalleled quality and performance with the ISOS141FDBQSEP by Texas Instruments. Designed to meet the highest industry standards, this versatile interface IC offers a wide range of applications across various industries. With its advanced technology and durable construction, this product ensures reliable operation in challenging environments. Trust Texas Instruments for cutting-edge solutions that deliver unmatched value and benefits to customers seeking top-tier performance. Elevate your projects with the ISOS141FDBQSEP and experience excellence like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5 V, the product can handle a wide range of power inputs reliably.

No. of Functions: 4

Having 4 functions in one IC adds versatility and functionality to the product, making it a versatile solution for various applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient PCB layout and space utilization, optimizing the overall design of the product.

No. of Terminals: 16

With 16 terminals, the product offers multiple connection points, enabling complex circuit configurations and connectivity options.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage of 2.25 V provides flexibility in power requirements and enables operation in lower power scenarios.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliable performance in demanding environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55°C allows the product to function effectively in cold temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB mounting orientation, making it easier to integrate the product into different system designs.

Width: 3.895 mm

Compact width of 3.895 mm allows for space-saving PCB layouts and enables dense packing of components for efficient use of board space.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can withstand high-temperature soldering processes, ensuring robust solder joints and reliable connections.

Temperature Grade: MILITARY

Military-grade temperature grade ensures the product meets stringent reliability and performance standards, making it suitable for mission-critical applications.

No. of Channels: 4

Having 4 channels allows the product to handle multiple inputs or outputs simultaneously, enhancing its functionality and versatility.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support, making it suitable for rugged applications where vibrations or mechanical stress may be present.

Nominal Supply Voltage: 2.5 V

A nominal supply voltage of 2.5 V ensures stable and reliable operation within the specified voltage range, providing consistent performance.

Technical Specifications

Other Function Interface ICs ISOS141FDBQSEP attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Total Dose (V):

30k Rad(Si)

Width:

3.895 mm

Trade Compliance

ISOS141FDBQSEP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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