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ISO130UB

Texas Instruments

ISO130UB by Texas Instruments

ISO130UB by Texas Instruments is an Isolation Amplifier with 5V nominal voltage, 3750V min isolation voltage, and 15.5mA max supply current. It is used in industrial applications requiring high common mode voltage tolerance and dual terminal position for precise measurements.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,366 parts In-Stock

1+ parts

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3,366

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Vyrian

USA . 2,538 parts In-Stock

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2,538

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,831 parts In-Stock

1+ parts

$0.410

100+ parts

-

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1,831

$0.410

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Parana Technologies

USA . 348 parts In-Stock

1+ parts

$1.907

100+ parts

-

1k+ parts

$2.445

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348

$1.907

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$2.445

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DigiPath Technology Company

USA . 751 parts In-Stock

1+ parts

$2.100

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751

$2.100

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ChromeModa Solutions

Germany . 3,685 parts In-Stock

1+ parts

$2.143

100+ parts

$1.757

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3,685

$2.143

$1.757

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IDEA Electronic Components Group

UK . 1,024 parts In-Stock

1+ parts

$2.143

100+ parts

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$1.929

10k+ parts

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1,024

$2.143

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$1.929

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AZTECH Wire

Italy . 752 parts In-Stock

1+ parts

$16.602

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752

$16.602

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Corphita

USA . 2,680 parts In-Stock

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2,680

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Computer Components Inc. - USA

USA . 8 parts In-Stock

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8

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Overview

Experience unparalleled quality and reliability with the Texas Instruments ISO130UB Isolation Amplifier. Designed with precision and care by a trusted manufacturer, this amplifier offers seamless isolation for a wide range of applications. Whether you're looking to improve safety in industrial settings or enhance performance in automotive systems, the ISO130UB provides unmatched value and peace of mind. Say goodbye to interference and hello to superior performance with this cutting-edge product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and reliable, making the isolation amplifier suitable for a variety of environments.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into PCB designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with common power sources.

Maximum Common Mode Voltage: 2.6 V

High maximum common mode voltage ensures effective isolation of input and output signals.

Minimum Voltage Gain: 7.85

With a minimum voltage gain of 7.85, this isolation amplifier provides accurate signal amplification.

Maximum Supply Current: 15.5 mA

Low maximum supply current helps to minimize power consumption and heat generation.

Minimum Isolation Voltage: 3750 V

High minimum isolation voltage ensures safe separation of input and output circuits.

Technical Specifications

Isolation Amplifiers ISO130UB attributes and parameters. Explore more Isolation Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

Hybrid

Power Supply:

5 V

Total Functions:

1

Sub-Category:

Isolation Amplifiers

Performance Specifications

Maximum Common Mode Voltage:

2.6 V

Minimum Voltage Gain:

7.85

Maximum Voltage Gain:

8.01

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Maximum Supply Current:

15.5 mA

Minimum Isolation Voltage:

3.75 KV

Physical Characteristics

Length:

0.38 in (9.655 mm)

Width:

0.25 in (6.35 mm)

Maximum Seated Height:

0.185 in (4.7 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

GWDIP8,.4

Trade Compliance

ISO130UB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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