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HCPL-7840-E

Broadcom

HCPL-7840-E by Broadcom

ISOLATION AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Digiode

USA . 353 parts In-Stock

1+ parts

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353

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Vyrian

USA . 96 parts In-Stock

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96

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Decca Corp

Germany . 425 parts In-Stock

1+ parts

$23.000

100+ parts

$22.540

1k+ parts

$22.315

10k+ parts

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425

$23.000

$22.540

$22.315

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Native Components

USA . 914 parts In-Stock

1+ parts

$59.900

100+ parts

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10k+ parts

$57.504

914

$59.900

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$57.504

Northwest PG Solutions

USA . 719 parts In-Stock

1+ parts

$65.890

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719

$65.890

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Supply Digital

USA . 1,389 parts In-Stock

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1,389

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Corphita

USA . 459 parts In-Stock

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459

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Technical Specifications

Isolation Amplifiers HCPL-7840-E attributes and parameters. Explore more Isolation Amplifiers devices from Broadcom

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Total Functions:

1

Performance Specifications

Nominal Bandwidth (3dB):

100 MHz

Maximum Common Mode Voltage:

2.8 V

Minimum Voltage Gain:

7.6

Maximum Voltage Gain:

8.4

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Isolation Voltage:

3.75 KV

Physical Characteristics

Length:

0.386 in (9.8 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.185 in (4.7 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T8

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

In-Line

Trade Compliance

HCPL-7840-E Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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