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HPA00068IPAP

Texas Instruments

HPA00068IPAP by Texas Instruments

Texas Instruments' HPA00068IPAP is a 12-bit ADC with 0.0366% EL, 125 MHz sample rate, and 3.3V supply voltage. Ideal for industrial applications, it features a quad-terminal position, operates b/w -40 to 85 °C, and offers parallel output in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,281 parts In-Stock

1+ parts

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7,281

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Digiode

USA . 3,845 parts In-Stock

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3,845

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 584 parts In-Stock

1+ parts

$12.163

100+ parts

-

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584

$12.163

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Parana Technologies

USA . 1,494 parts In-Stock

1+ parts

$22.277

100+ parts

$2,068.730

1k+ parts

$20.049

10k+ parts

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1,494

$22.277

$2,068.730

$20.049

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DigiPath Technology Company

USA . 242 parts In-Stock

1+ parts

$24.529

100+ parts

$22.567

1k+ parts

-

10k+ parts

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242

$24.529

$22.567

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ChromeModa Solutions

Germany . 3,699 parts In-Stock

1+ parts

$25.030

100+ parts

$20.525

1k+ parts

-

10k+ parts

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3,699

$25.030

$20.525

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IDEA Electronic Components Group

UK . 928 parts In-Stock

1+ parts

$25.030

100+ parts

$23.778

1k+ parts

$22.527

10k+ parts

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928

$25.030

$23.778

$22.527

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One Stop Electronics

USA . 413 parts In-Stock

1+ parts

$30.000

100+ parts

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413

$30.000

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Corphita

USA . 3,263 parts In-Stock

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3,263

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Overview

Elevate your analog-to-digital conversion experience with the Texas Instruments HPA00068IPAP. Crafted with precision and expertise, this high-quality converter offers unparalleled performance and reliability. Whether you're in the industrial sector or pursuing innovative projects, this product delivers exceptional value and benefits. Say goodbye to compromises and hello to seamless integration and top-notch results. Upgrade your systems with the best in the market and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort.

No. of Bits: 12

A higher number of bits (12 in this case) provides greater resolution and accuracy in converting analog signals to digital.

Maximum Linearity Error (EL): 0.0366%

The low maximum linearity error ensures precision in the conversion process, leading to accurate digital output.

No. of Terminals: 64

Having a higher number of terminals allows for more connectivity options and flexibility in system integration.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the product suitable for industrial applications where temperature variations may occur.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and compatibility with a wide range of devices.

Sample Rate: 125 MHz

A high sample rate of 125 MHz enables the product to accurately capture and convert fast-changing analog signals.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage makes the product compatible with standard power sources, simplifying integration into existing systems.

Technical Specifications

Analog-to-Digital Converters HPA00068IPAP attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0366 %

Sample Rate:

125 MHz

Hold Mode:

Sample

Electrical Specifications

Minimum Analog Input Voltage:

-2.3 V

Maximum Analog Input Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Trade Compliance

HPA00068IPAP Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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