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HPA00024GR

Texas Instruments

HPA00024GR by Texas Instruments

The Texas Instruments HPA00024GR is a 14-bit ADC with 7 analog input channels. It features a small outline package, dual terminal position, and operates b/w 0-70°C. Ideal for applications requiring precise analog-to-digital conversion in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,252 parts In-Stock

1+ parts

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4,252

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Vyrian

USA . 2,216 parts In-Stock

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2,216

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 379 parts In-Stock

1+ parts

$8.442

100+ parts

-

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379

$8.442

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Parana Technologies

USA . 253 parts In-Stock

1+ parts

$11.499

100+ parts

-

1k+ parts

$11.912

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253

$11.499

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$11.912

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DigiPath Technology Company

USA . 849 parts In-Stock

1+ parts

$12.662

100+ parts

$11.649

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849

$12.662

$11.649

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IDEA Electronic Components Group

UK . 1,720 parts In-Stock

1+ parts

$12.920

100+ parts

$12.274

1k+ parts

$11.628

10k+ parts

-

1,720

$12.920

$12.274

$11.628

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ChromeModa Solutions

Germany . 1,167 parts In-Stock

1+ parts

$12.920

100+ parts

$10.594

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1,167

$12.920

$10.594

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One Stop Electronics

USA . 1,436 parts In-Stock

1+ parts

$29.000

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1,436

$29.000

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Component Stockers USA

USA . 575 parts In-Stock

1+ parts

$99.990

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575

$99.990

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Corphita

USA . 3,061 parts In-Stock

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3,061

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Microchip USA

USA . 1,093 parts In-Stock

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1,093

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Overview

Elevate your analog-to-digital conversion with the HPA00024GR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This 14-bit ADC boasts 7 analog input channels, making it perfect for a wide range of applications. With a small outline package style and dual terminal position, this converter offers ease of use and versatility. Upgrade your projects with the precision and performance that Texas Instruments delivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

No. of Analog In Channels: 7

Allows for multiple input signals to be converted to digital data simultaneously, enhancing versatility and flexibility.

Surface Mount: YES

Facilitates easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Bits: 14

Offers high resolution and accuracy in converting analog signals to digital data, producing precise results.

No. of Terminals: 48

Enables seamless connectivity and integration with other components in the circuit for seamless data transfer.

Maximum Operating Temperature: 70 °C

Ensures stable operation even in high-temperature environments, making it suitable for various applications.

Width: 6.1 mm

Compact size allows for space-saving installation, ideal for applications with limited board space.

Nominal Supply Voltage: 2.5 V

Efficient power consumption and compatibility with common voltage sources, enhancing overall energy efficiency.

Technical Specifications

Analog-to-Digital Converters HPA00024GR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

7

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Binary

Electrical Specifications

Nominal Supply Voltage:

2.5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.24 in (6.1 mm)

Length:

0.492 in (12.5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Trade Compliance

HPA00024GR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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