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HCPL2731

Texas Instruments

HCPL2731 by Texas Instruments

The Texas Instruments HCPL2731 is a 2-channel optocoupler with built-in resistor, offering a max forward current of 0.02A and isolation voltage of 3000V. Ideal for logic IC output applications, it operates b/w 0-70°C with a nominal data rate of 0.1MBps and max on-state current of 0.06A.

Median Price

$3.286

Lifecycle Status

Suppliers In-Stock

53

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Distrelec

Netherlands . 295 parts In-Stock

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$3.286

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$3.100

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$2.631

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$2.314

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DigiPath Technology Company

USA . 788 parts In-Stock

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$0.654

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$0.601

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ChromeModa Solutions

Germany . 879 parts In-Stock

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$0.667

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$0.547

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IDEA Electronic Components Group

UK . 590 parts In-Stock

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$0.667

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$0.600

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Aranea Global

USA . 50 parts In-Stock

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$2.715

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$2.606

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Continental Prestige Electronics

USA . 7,061 parts In-Stock

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Argo Parts USA

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Semicontronic

India . 605 parts In-Stock

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$2.790

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$2.720

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$2.706

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Corphita

USA . 3,600 parts In-Stock

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$2.957

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Germany . 770 parts In-Stock

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$5.958

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$5.899

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USA . 40,287 parts In-Stock

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Overview

Elevate your circuit designs with the Texas Instruments HCPL2731 Optocoupler Circuit Outputs. Crafted with precision by a trusted manufacturer, this optoelectronic marvel offers superior quality and reliability. With two separate channels and built-in resistors, this versatile component is ready to enhance your projects with seamless functionality and enhanced performance. Perfect for a variety of applications, from industrial automation to medical equipment, the HCPL2731 provides exceptional value and benefits, ensuring smooth operation and peace of mind for customers. Experience innovation at its finest with the HCPL2731.

Feature Benefit Bullets

Configuration: SEPARATE, 2 CHANNELS WITH BUILT-IN RESISTOR

The separate configuration with 2 channels and built-in resistor allows for individual control of each channel, providing flexibility in usage.

No. of Functions: 2

Having 2 functions enables the optocoupler to perform multiple tasks simultaneously, increasing efficiency.

Maximum Forward Current: 0.02 A

The high maximum forward current capability of 0.02 A ensures that the optocoupler can handle demanding applications without any risk of overload.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Being a logic IC output optocoupler means that it is specifically designed for interfacing with logic circuits, ensuring compatibility and seamless integration.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this optocoupler can function reliably even in high-temperature environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the optocoupler can operate efficiently in a wide range of temperatures, making it versatile.

No. of Elements: 2

Having 2 elements allows for redundancy and increased reliability in operation, making the optocoupler a dependable choice.

Maximum Isolation Voltage: 3000 V

The high maximum isolation voltage of 3000 V provides excellent protection against voltage spikes and ensures safe operation in high-voltage applications.

Nominal Data Rate: 0.1 MBps

With a nominal data rate of 0.1 MBps, this optocoupler can transmit data at a relatively high speed, making it suitable for applications requiring fast data transfer.

Maximum On State Current: 0.06 A

The high maximum on-state current rating of 0.06 A allows the optocoupler to handle heavy loads with ease, making it a reliable choice for demanding applications.

Technical Specifications

Optocoupler Circuit Outputs HCPL2731 attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Texas Instruments

Specs

Additional Features:

CMOS COMPATIBLE, UL RECOGNIZED

Configuration:

SEPARATE, 2 CHANNELS WITH BUILT-IN RESISTOR

Nominal Data Rate:

.1 MBps

Maximum Forward Current:

.02 A

Maximum Isolation Voltage:

3000 V

No. of Elements:

2

No. of Functions:

2

Maximum On State Current:

.06 A

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Optoelectronic Type:

Trade Compliance

HCPL2731 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

NSN

5980-01-229-7417, 5980012297417, 5980-01-073-5344, 5980010735344

NIIN

012297417, 010735344

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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