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HCPL-0500.R2

Onsemi

HCPL-0500.R2 by Onsemi

HCPL-0500.R2 by Onsemi is a SINGLE optocoupler with 2500V isolation voltage, 0.025A forward current, and 1MBps data rate. Ideal for logic IC output applications, it operates b/w -40 to 85°C with 0.008A on-state current.

Median Price

$1.077

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 28 parts In-Stock

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$1.077

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Digiode

USA . 3,003 parts In-Stock

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Vyrian

USA . 904 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 60 parts In-Stock

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$1.055

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Bastille Electronics

Australia . 69 parts In-Stock

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$1.077

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$1.023

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$0.972

10k+ parts

$0.959

69

$1.077

$1.023

$0.972

$0.959

Continental Prestige Electronics

USA . 5,123 parts In-Stock

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$1.077

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$1.056

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$1.056

Argo Parts USA

USA . 2,827 parts In-Stock

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$1.077

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AZTECH Wire

Italy . 207 parts In-Stock

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$12.377

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Kulean Microsystems

USA . 5,931 parts In-Stock

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SupplyDigital Components

Austria . 5,484 parts In-Stock

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Corphita

USA . 3,257 parts In-Stock

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TANS Electronics

Latvia . 2,866 parts In-Stock

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Problanco Electronics

Mexico . 2,021 parts In-Stock

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Supply Digital

USA . 1,946 parts In-Stock

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UHIMA Technologies

Türkiye . 202 parts In-Stock

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Overview

Experience the superior quality and reliability of Onsemi with the HCPL-0500.R2 optocoupler circuit output. This single configuration device offers a maximum isolation voltage of 2500V, making it ideal for high-performance applications. With a nominal data rate of 1 MBps and a maximum forward current of 0.025 A, this logic IC output optocoupler ensures seamless communication in your systems. Trust Onsemi for cutting-edge technology that delivers exceptional value and performance to meet your needs. Elevate your projects with the HCPL-0500.R2 and experience the difference today.

Feature Benefit Bullets

Configuration: SINGLE

Having a single configuration simplifies the setup process and makes it easier to integrate into existing circuits.

Maximum Forward Current: 0.025 A

With a high maximum forward current, this optocoupler circuit output can handle more power without overheating.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

This specific type ensures reliable performance when interfacing with logic ICs, making it ideal for digital applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for use in harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the optocoupler circuit output remains functional even in cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a durable coating that enhances conductivity and prevents corrosion.

Maximum Isolation Voltage: 2500 V

The high maximum isolation voltage helps prevent voltage spikes and ensures safe operation in high voltage environments.

Nominal Data Rate: 1 MBps

With a fast nominal data rate of 1 MBps, this optocoupler circuit output is suitable for high-speed data transmission applications.

Maximum On State Current: 0.008 A

The low maximum on-state current helps minimize power consumption and heat generation, making this product energy-efficient.

Technical Specifications

Optocoupler Circuit Outputs HCPL-0500.R2 attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED, OPEN COLLECTOR OUTPUT

Configuration:

SINGLE

Nominal Data Rate:

1 MBps

Maximum Forward Current:

.025 A

Maximum Isolation Voltage:

2500 V

JESD-609 Code:

e3

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.008 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Terminal Finish:

Trade Compliance

HCPL-0500.R2 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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