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FX002

Texas Instruments

FX002 by Texas Instruments

SWITCHING CONTROLLER; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 2; Peak Reflow Temperature (C): 260;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,345 parts In-Stock

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8,345

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Digiode

USA . 3,782 parts In-Stock

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3,782

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 63 parts In-Stock

1+ parts

$2.640

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-

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63

$2.640

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Ampacity Inc.

Singapore . 1,474 parts In-Stock

1+ parts

$3.500

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1,474

$3.500

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One Stop Electronics

USA . 490 parts In-Stock

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$3.500

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490

$3.500

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Semicontronic

India . 735 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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735

$4.500

$4.388

$4.365

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Parana Technologies

USA . 319 parts In-Stock

1+ parts

$14.485

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$14.929

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319

$14.485

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$14.929

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DigiPath Technology Company

USA . 1,922 parts In-Stock

1+ parts

$15.950

100+ parts

$14.674

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1,922

$15.950

$14.674

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ChromeModa Solutions

Germany . 3,322 parts In-Stock

1+ parts

$16.275

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$13.346

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3,322

$16.275

$13.346

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IDEA Electronic Components Group

UK . 2,339 parts In-Stock

1+ parts

$16.275

100+ parts

$15.461

1k+ parts

$14.648

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2,339

$16.275

$15.461

$14.648

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AZTECH Wire

Italy . 237 parts In-Stock

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$17.982

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237

$17.982

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Corphita

USA . 3,163 parts In-Stock

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3,163

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Native Components

USA . 140 parts In-Stock

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$2.328

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140

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$2.328

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Corohmni

South Africa . 71 parts In-Stock

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71

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Technical Specifications

Switching Regulators & Controllers FX002 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Moisture Sensitivity Level (MSL):

2

Peak Reflow Temperature (C):

260

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

FX002 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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