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FX007

Texas Instruments

FX007 by Texas Instruments

The Texas Instruments FX007 is a dual switching controller with a max output current of 20A and a max input voltage of 28V. Operating in voltage-mode control technique, it offers a wide range of applications in switching regulators & controllers, with a compact chip carrier package style suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,874 parts In-Stock

1+ parts

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5,874

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Digiode

USA . 1,348 parts In-Stock

1+ parts

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1,348

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 899 parts In-Stock

1+ parts

$1.500

100+ parts

-

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899

$1.500

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One Stop Electronics

USA . 1,302 parts In-Stock

1+ parts

$4.500

100+ parts

-

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1,302

$4.500

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Semicontronic

India . 320 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

10k+ parts

-

320

$5.500

$5.362

$5.335

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Native Components

USA . 407 parts In-Stock

1+ parts

$7.207

100+ parts

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407

$7.207

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AZTECH Wire

Italy . 456 parts In-Stock

1+ parts

$11.084

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456

$11.084

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Parana Technologies

USA . 1,554 parts In-Stock

1+ parts

$11.486

100+ parts

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1k+ parts

$11.898

10k+ parts

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1,554

$11.486

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$11.898

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ChromeModa Solutions

Germany . 5,866 parts In-Stock

1+ parts

$12.906

100+ parts

$10.583

1k+ parts

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5,866

$12.906

$10.583

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IDEA Electronic Components Group

UK . 1,348 parts In-Stock

1+ parts

$12.906

100+ parts

$12.261

1k+ parts

$11.615

10k+ parts

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1,348

$12.906

$12.261

$11.615

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Corphita

USA . 2,391 parts In-Stock

1+ parts

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2,391

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Corohmni

South Africa . 358 parts In-Stock

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358

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Northwest PG Solutions

USA . 196 parts In-Stock

1+ parts

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100+ parts

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$7.063

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196

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$7.063

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DigiPath Technology Company

USA . 128 parts In-Stock

1+ parts

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100+ parts

$11.636

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128

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$11.636

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Overview

Experience superior quality and precision with the FX007 by Texas Instruments. As a leading manufacturer in the industry of Switching Regulators & Controllers, Texas Instruments delivers cutting-edge technology packaged in a sleek, durable design. The FX007 offers unmatched performance and reliability, making it perfect for a wide range of applications. From its advanced control mode to its high output current, this product is engineered to exceed your expectations. Elevate your projects with the FX007 and enjoy the benefits of top-notch innovation at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the product.

Surface Mount: YES

Enables easy integration onto circuit boards.

Package Shape: SQUARE

Provides a compact design for space-saving purposes.

No. of Terminals: 48

Offers a high level of connectivity for versatile applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Allows for efficient heat dissipation and compact design.

Maximum Operating Temperature: 105 °C

Ensures reliable operation in various environmental conditions.

Minimum Output Voltage: 0.25 V

Provides precise voltage regulation for different applications.

Control Mode: VOLTAGE-MODE

Offers reliable control over the output voltage.

Minimum Operating Temperature: -10 °C

Ensures functionality even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures good electrical conductivity.

Maximum Output Voltage: 1.52 V

Allows for a wide range of output voltage options.

Terminal Position: QUAD

Enables easy connection to other components on the circuit board.

Maximum Seated Height: 1 mm

Ensures a low-profile design for compact systems.

Width (mm): 6 mm

Compact size for space-constrained applications.

Other IC type: DUAL SWITCHING CONTROLLER

Supports the operation of dual outputs for added functionality.

Nominal Input Voltage: 3.3 V

Ideal input voltage for efficient power conversion.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

Ensures proper soldering of the component onto the circuit board.

Length: 6 mm

Compact size for space-saving in electronic devices.

Maximum Switching Frequency: 600 kHz

Offers fast switching for efficient power conversion.

Maximum Output Current: 20 A

Supports high output current for demanding applications.

Terminal Form: NO LEAD

Lead-free construction for environmental compliance.

Control Technique: PULSE WIDTH MODULATION

Provides precise control over the output voltage.

Switcher Config: BUCK

Efficient buck converter configuration for voltage regulation.

Terminal Pitch: 0.4 mm

Fine pitch for compact layout and high-density integration.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture during storage and handling.

Minimum Input Voltage: 3 V

Supports a wide range of input voltages for flexibility.

No. of Outputs: 2

Provides dual outputs for multiple power supply options.

Maximum Input Voltage: 28 V

Allows for input voltages up to 28V for various applications.

Technical Specifications

Switching Regulators & Controllers FX007 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES IN 5 VOLT NOMINAL SUPPLY VOLTAGE

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

28 V

Minimum Input Voltage:

3 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-10 Cel

Maximum Output Current:

20 A

Maximum Output Voltage:

1.52 V

Minimum Output Voltage:

.25 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

600 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

FX007 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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