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FPC401RHUR

Texas Instruments

FPC401RHUR by Texas Instruments

FPC401RHUR by Texas Instruments is a 56-terminal interface IC with a rectangular shape and chip carrier package style. It operates in industrial temperature range (-40 to 85°C) with matte tin finish terminals. Suitable for applications requiring very thin profile and surface mount compatibility, such as electronic devices and communication systems.

Median Price

$5.343

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,991 parts In-Stock

1+ parts

$5.343

100+ parts

$4.356

1k+ parts

$2.904

10k+ parts

-

3,991

$5.343

$4.356

$2.904

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,726 parts In-Stock

1+ parts

$5.076

100+ parts

-

1k+ parts

-

10k+ parts

-

3,726

$5.076

-

-

-

Vyrian

USA . 8,725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,725

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 562 parts In-Stock

1+ parts

$0.850

100+ parts

-

1k+ parts

-

10k+ parts

-

562

$0.850

-

-

-

Northwest PG Solutions

USA . 56 parts In-Stock

1+ parts

$0.936

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$0.936

-

-

-

Corphita

USA . 4,202 parts In-Stock

1+ parts

$4.809

100+ parts

-

1k+ parts

-

10k+ parts

-

4,202

$4.809

-

-

-

Parana Technologies

USA . 1,649 parts In-Stock

1+ parts

$6.558

100+ parts

-

1k+ parts

$7.300

10k+ parts

-

1,649

$6.558

-

$7.300

-

ChromeModa Solutions

Germany . 1,783 parts In-Stock

1+ parts

$7.368

100+ parts

$6.042

1k+ parts

-

10k+ parts

-

1,783

$7.368

$6.042

-

-

IDEA Electronic Components Group

UK . 1,060 parts In-Stock

1+ parts

$7.368

100+ parts

-

1k+ parts

$6.631

10k+ parts

-

1,060

$7.368

-

$6.631

-

AZTECH Wire

Italy . 1,028 parts In-Stock

1+ parts

$9.710

100+ parts

-

1k+ parts

-

10k+ parts

-

1,028

$9.710

-

-

-

Microchip USA

USA . 3,357 parts In-Stock

1+ parts

$25.270

100+ parts

$25.120

1k+ parts

$25.040

10k+ parts

$24.960

3,357

$25.270

$25.120

$25.040

$24.960

Component Stockers USA

USA . 6,256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,256

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,565 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,565

-

-

-

-

Alle Elektronik GmbH

Germany . 3,043 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,043

-

-

-

-

DigiPath Technology Company

USA . 422 parts In-Stock

1+ parts

-

100+ parts

$6.643

1k+ parts

-

10k+ parts

-

422

-

$6.643

-

-

Overview

Unlock endless possibilities with the FPC401RHUR by Texas Instruments. Crafted with precision and excellence, this chip carrier interface IC offers unparalleled quality and reliability. Perfect for a wide range of applications, this innovative product is designed to exceed your expectations. Embrace the future of technology with Texas Instruments and experience the value and benefits that the FPC401RHUR brings to your projects. Elevate your designs and take your creations to the next level with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the integrated circuits within the package, ensuring reliable performance.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

No. of Terminals: 56

Offers a sufficient number of connections for versatile functionality and integration with other components.

Maximum Operating Temperature: 85 °C

Ensures that the IC can operate effectively in a wide range of environmental conditions without risking damage.

Terminal Finish: MATTE TIN

Provides a reliable and consistent surface for soldering, ensuring a secure electrical connection.

Width: 5 mm

Compact size allows for efficient use of space on the PCB, ideal for applications with limited board real estate.

Length: 11 mm

Optimal dimensions for fitting within a variety of electronic devices, offering versatility in design.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, making it suitable for a wide range of applications.

Moisture Sensitivity Level (MSL): 2

Indicates the level of protection against moisture, ensuring reliability in humid or wet conditions.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing with other components and systems, making it a versatile choice for various applications.

Technical Specifications

Other Function Interface ICs FPC401RHUR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

HOST SIDE I/O SUPPLY VOLTAGE= 1.8V TO 3.3V

Interface IC Type:

JESD-30 Code:

R-PQCC-N56

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

FPC401RHUR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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