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FPC202RHUR

Texas Instruments

FPC202RHUR by Texas Instruments

FPC202RHUR by Texas Instruments is a 56-terminal interface IC with a package style of chip carrier, heat sink/slug, and very thin profile. It operates b/w -40 to 85°C, with a supply voltage range of 1.8V to 3.3V. Ideal for industrial applications requiring an interface circuit with surface mount capabilities.

Median Price

$5.829

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 37,115 parts In-Stock

1+ parts

$5.829

100+ parts

$4.752

1k+ parts

$3.168

10k+ parts

-

37,115

$5.829

$4.752

$3.168

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,002 parts In-Stock

1+ parts

$5.538

100+ parts

-

1k+ parts

-

10k+ parts

-

3,002

$5.538

-

-

-

Vyrian

USA . 6,591 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,591

-

-

-

-

Netsource Technology, Inc.

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,318 parts In-Stock

1+ parts

$5.246

100+ parts

-

1k+ parts

-

10k+ parts

-

4,318

$5.246

-

-

-

Parana Technologies

USA . 1,919 parts In-Stock

1+ parts

$9.307

100+ parts

$864.271

1k+ parts

$8.376

10k+ parts

-

1,919

$9.307

$864.271

$8.376

-

DigiPath Technology Company

USA . 484 parts In-Stock

1+ parts

$10.248

100+ parts

-

1k+ parts

-

10k+ parts

-

484

$10.248

-

-

-

IDEA Electronic Components Group

UK . 1,823 parts In-Stock

1+ parts

$10.457

100+ parts

$9.934

1k+ parts

$9.411

10k+ parts

-

1,823

$10.457

$9.934

$9.411

-

ChromeModa Solutions

Germany . 1,585 parts In-Stock

1+ parts

$10.457

100+ parts

$8.575

1k+ parts

-

10k+ parts

-

1,585

$10.457

$8.575

-

-

AZTECH Wire

Italy . 676 parts In-Stock

1+ parts

$13.590

100+ parts

-

1k+ parts

-

10k+ parts

-

676

$13.590

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,000

-

-

-

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Northwest PG Solutions

USA . 2,363 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,363

-

-

-

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Native Components

USA . 868 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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868

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Overview

Experience the unmatched reliability and performance of Texas Instruments with the FPC202RHUR, a cutting-edge interface IC designed for a wide range of applications. With its durable plastic/epoxy construction, surface mount capability, and impressive operating temperature range, this chip carrier offers unparalleled value and flexibility. Whether you're looking to enhance your industrial automation system or streamline your consumer electronics design, the FPC202RHUR delivers the quality and functionality you need to succeed. Trust Texas Instruments to provide trusted solutions for your innovative projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.3 V

Supports a maximum supply voltage of 3.3V, making it compatible with a wide range of power sources and applications.

Minimum Supply Voltage: 1.8 V

Can operate at a low minimum supply voltage of 1.8V, suitable for energy-efficient and battery-powered devices.

Maximum Operating Temperature: 85 °C

Withstands high operating temperatures up to 85°C, ensuring stable performance in various environments.

Minimum Operating Temperature: -40 °C

Operates effectively in low temperatures as low as -40°C, making it suitable for use in harsh conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability, ensuring secure connections during installation.

Terminal Position: QUAD

Quad terminal position offers a secure and stable connection to the PCB, minimizing the risk of disconnection or signal interference.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that the product is moderately sensitive to moisture, allowing for safe storage and handling in typical manufacturing environments.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interface circuit applications, ensuring compatibility and efficiency in communication between different components.

Technical Specifications

Other Function Interface ICs FPC202RHUR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N56

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.3 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

FPC202RHUR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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