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DS92LV010ATM

Texas Instruments

DS92LV010ATM by Texas Instruments

DS92LV010ATM by Texas Instruments is a CMOS Line Transceiver with 8 terminals. It operates at 3.3/5 V, has a max supply voltage of 5.5 V, and offers differential output. Ideal for industrial applications requiring fast data transmission with low power consumption and small form factor.

Median Price

$6.120

Lifecycle Status

Suppliers In-Stock

34

In-Stock Inventory

1k+

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DigiKey

USA . 2 parts In-Stock

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Nova Conductors

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Digiode

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Atlantic Semiconductor

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Flex Direct, LLC

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LIBRA Elektronik GmbH

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Speed Components Ltd

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QIE Inc.

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ComSIT Distribution GmbH

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EMSNET

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Classic Components Corporation

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PC Components Company LLC

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First Choice Components Inc.

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Inventory MP

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Continental Prestige Electronics

USA . 2,430 parts In-Stock

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$3.690

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$3.616

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Argo Parts USA

USA . 1,130 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Ampacity Inc.

Singapore . 2 parts In-Stock

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$5.200

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Corphita

USA . 3,123 parts In-Stock

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Parana Technologies

USA . 1,119 parts In-Stock

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$10.215

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$10.749

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AZTECH Wire

Italy . 289 parts In-Stock

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ChromeModa Solutions

Germany . 3,384 parts In-Stock

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$11.477

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IDEA Electronic Components Group

UK . 165 parts In-Stock

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$11.477

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$10.903

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$10.329

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Microchip USA

USA . 314 parts In-Stock

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$17.610

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$17.490

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Lixinc

USA . 19,433 parts In-Stock

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Perfect Parts

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Alle Elektronik GmbH

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Assy Fe

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DigiPath Technology Company

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Cyclops Electronics Ltd (Excess)

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Fairview Electronics Ltd

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Overview

Experience top-notch quality and reliability with the DS92LV010ATM by Texas Instruments, a leading manufacturer in the industry. This line driver & receiver offers seamless performance in various applications, ensuring optimal functionality and efficiency. With its innovative design and advanced features, this product delivers unparalleled value and benefits to customers. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable makes the product suitable for integration into compact electronic devices and circuit boards, saving space and enabling efficient design.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, the product is compatible with a wide range of power sources, increasing its versatility in different applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and orientation during assembly, enhancing the user-friendliness of the product.

Maximum Transmit Delay: 5 ns

The low transmit delay ensures fast and efficient signal transmission, making the product suitable for high-speed data communication requirements.

Power Supplies (V): 3.3/5

The support for multiple power supply voltages (3.3V and 5V) offers flexibility in compatibility with different systems and reduces the need for external voltage conversion circuitry.

No. of Terminals: 8

The 8 terminals provide sufficient connectivity options for interfacing with other components or devices, enabling versatile integration within various electronic systems.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement ensures energy-efficient operation and compatibility with a wide range of power sources, enhancing the product's usability.

Output Characteristics: DIFFERENTIAL

The differential output enhances noise immunity and signal integrity, making the product ideal for applications where signal accuracy and reliability are critical.

Minimum Operating Temperature: -40 °C

The wide operating temperature range (-40 to 85°C) ensures reliable performance in harsh environmental conditions, making the product suitable for industrial applications.

Peak Reflow Temperature °C: 235

The high peak reflow temperature tolerance ensures the product can withstand temperature variations during soldering processes, guaranteeing robust assembly and reliability.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high noise immunity, and fast switching speeds, making it suitable for high-performance and energy-efficient applications.

Technical Specifications

Line Drivers & Receivers DS92LV010ATM attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.145 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

2 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

12 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

22 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Maximum Transmit Delay:

5 ns

Width:

3.9 mm

Trade Compliance

DS92LV010ATM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-578-2064, 5962015782064

NIIN

015782064

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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