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DS91D180TMAX

Texas Instruments

DS91D180TMAX by Texas Instruments

DS91D180TMAX by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 5.5ns max transmit delay, and 3.3V power supplies. Ideal for industrial applications requiring EIA-899/TIA-899 interface standard compliance and differential input characteristics in a compact small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,028 parts In-Stock

1+ parts

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7,028

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Digiode

USA . 3,187 parts In-Stock

1+ parts

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3,187

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Anansix

USA . 1,489 parts In-Stock

1+ parts

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1,489

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,630 parts In-Stock

1+ parts

$12.438

100+ parts

-

1k+ parts

$12.878

10k+ parts

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1,630

$12.438

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$12.878

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DigiPath Technology Company

USA . 1,187 parts In-Stock

1+ parts

$13.696

100+ parts

$12.600

1k+ parts

-

10k+ parts

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1,187

$13.696

$12.600

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ChromeModa Solutions

Germany . 6,134 parts In-Stock

1+ parts

$13.975

100+ parts

$11.460

1k+ parts

-

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6,134

$13.975

$11.460

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IDEA Electronic Components Group

UK . 366 parts In-Stock

1+ parts

$13.975

100+ parts

$13.276

1k+ parts

$12.578

10k+ parts

-

366

$13.975

$13.276

$12.578

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AZTECH Wire

Italy . 349 parts In-Stock

1+ parts

$17.076

100+ parts

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349

$17.076

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One Stop Electronics

USA . 1,152 parts In-Stock

1+ parts

$21.500

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1,152

$21.500

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Glotronic Ltd.

UK . 3,500 parts In-Stock

1+ parts

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3,500

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Corphita

USA . 3,431 parts In-Stock

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3,431

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Native Components

USA . 813 parts In-Stock

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813

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Microchip USA

USA . 432 parts In-Stock

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432

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Northwest PG Solutions

USA . 114 parts In-Stock

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114

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Overview

The DS91D180TMAX by Texas Instruments is a high-quality line driver and receiver designed to deliver superior performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, this product guarantees top-notch quality that customers can trust. Ideal for a wide range of applications, this line driver offers unparalleled value with its fast transmission speeds and low power consumption. Experience seamless connectivity and enhanced efficiency with the DS91D180TMAX, the ultimate solution for all your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable and long-lasting applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and space in the design.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage tolerance makes the product versatile and compatible with various voltage requirements in different systems.

Package Shape: RECTANGULAR

Rectangular shape is standard and convenient for fitting into standard circuits and layouts.

Maximum Transmit Delay: 5.5 ns

Low transmit delay ensures fast and efficient data transmission, critical for high-speed applications.

Power Supplies (V): 3.3

Stable power supply at 3.3 volts ensures consistent and reliable performance of the product.

No. of Terminals: 14

Sufficient terminals allow for versatile connectivity and integration within a circuit or system.

Package Style (Meter): SMALL OUTLINE

Small outline package style enables compact and space-saving designs, ideal for applications with limited space.

Maximum High Level Input Current: 0.000015 Amp

Low high level input current minimizes power consumption and heat generation, contributing to energy efficiency.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement ensures compatibility with various power sources, providing flexibility in system design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in both hot and cold environments without compromising performance.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good conductivity and solderability, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit layout and integration, accommodating different design requirements.

Maximum Seated Height: 1.75 mm

Low seated height allows for low-profile installations, ideal for applications with space constraints.

Width: 3.9 mm

Narrow width allows for compact and space-efficient circuit board layouts, saving precious board space.

Maximum Output Low Current: 8 Amp

The high maximum output low current rating ensures the product can drive demanding loads without overheating or failure.

Differential Output: YES

Differential output provides noise immunity and signal integrity, making the product suitable for high-noise environments.

Maximum Time At Peak Reflow Temperature (s): 20

Long peak reflow time allows for proper soldering and mounting of the product onto the circuit board.

Peak Reflow Temperature °C: 235

High peak reflow temperature tolerance ensures adequate soldering and reliability during the assembly process.

Length: 8.65 mm

Compact length allows for space-efficient component placement and arrangement on the circuit board.

Minimum Out Swing: 0.48 V

Low minimum out swing ensures accurate signal transmission and reception, critical for maintaining data integrity.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the product can withstand harsh operating conditions in industrial environments.

Maximum Receive Delay: 7.5 ns

Low receive delay ensures fast data reception, enhancing overall system performance and responsiveness.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and easy assembly onto the circuit board.

Interface Standard: EIA-899; TIA-899

Compliance with interface standards ensures interoperability and compatibility with other devices and systems following the same standards.

Maximum Supply Current: 29.5 mA

Low maximum supply current draw helps in maintaining energy efficiency and reducing power consumption.

Input Characteristics: DIFFERENTIAL

Differential input characteristics improve noise immunity and signal quality, suitable for demanding industrial applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance under different load conditions, enhancing overall reliability.

Terminal Pitch: 1.27 mm

Narrow terminal pitch allows for compact component placement on the circuit board, saving space and enabling high-density designs.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type ensures seamless communication between different systems and devices, making integration smoother and more efficient.

Technical Specifications

Line Drivers & Receivers DS91D180TMAX attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.000015 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-899; TIA-899

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.48 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

7.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

29.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Maximum Transmit Delay:

5.5 ns

Width:

3.9 mm

Trade Compliance

DS91D180TMAX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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