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DS91D176TMA

Texas Instruments

DS91D176TMA by Texas Instruments

DS91D176TMA by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3-3.6V. It has a max transmit delay of 5ns and receive delay of 7.5ns, suitable for industrial applications requiring EIA-899/TIA-899 interface standard compliance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,510 parts In-Stock

1+ parts

-

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3,510

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Digiode

USA . 2,081 parts In-Stock

1+ parts

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2,081

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Anansix

USA . 1,586 parts In-Stock

1+ parts

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100+ parts

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1,586

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,109 parts In-Stock

1+ parts

$2.226

100+ parts

-

1k+ parts

$2.730

10k+ parts

-

2,109

$2.226

-

$2.730

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DigiPath Technology Company

USA . 468 parts In-Stock

1+ parts

$2.451

100+ parts

$2.255

1k+ parts

-

10k+ parts

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468

$2.451

$2.255

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IDEA Electronic Components Group

UK . 1,439 parts In-Stock

1+ parts

$2.501

100+ parts

-

1k+ parts

$2.251

10k+ parts

-

1,439

$2.501

-

$2.251

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ChromeModa Solutions

Germany . 651 parts In-Stock

1+ parts

$2.501

100+ parts

$2.051

1k+ parts

-

10k+ parts

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651

$2.501

$2.051

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Native Components

USA . 244 parts In-Stock

1+ parts

$8.175

100+ parts

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244

$8.175

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Northwest PG Solutions

USA . 64 parts In-Stock

1+ parts

$8.993

100+ parts

$8.093

1k+ parts

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64

$8.993

$8.093

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AZTECH Wire

Italy . 586 parts In-Stock

1+ parts

$9.855

100+ parts

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586

$9.855

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One Stop Electronics

USA . 256 parts In-Stock

1+ parts

$22.500

100+ parts

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256

$22.500

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Corphita

USA . 3,585 parts In-Stock

1+ parts

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3,585

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Lixinc

USA . 3,528 parts In-Stock

1+ parts

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3,528

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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2,800

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Overview

Enhance your electronic designs with the DS91D176TMA by Texas Instruments, a top-of-the-line line driver & receiver that guarantees exceptional quality and performance. With Texas Instruments' renowned reputation for innovation and reliability, this product is sure to exceed your expectations. Ideal for a variety of applications, this compact device offers unmatched value, providing fast transmission speeds and precise signal integrity. Say goodbye to delays and hello to seamless communication with the DS91D176TMA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability makes it easy to integrate into electronic circuits.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6 V for versatile compatibility.

No. of Functions: 2

Multiple functions allow for enhanced performance and functionality.

Package Shape: RECTANGULAR

Rectangular package shape offers a compact design for space-saving installations.

Maximum Transmit Delay: 5 ns

Low transmit delay of 5 ns ensures fast data transmission speed.

No. of Terminals: 8

8 terminals provide sufficient connection points for interface and communication.

Package Style (Meter): SMALL OUTLINE

Small outline package style is convenient for compact electronic device design.

Minimum Supply Voltage: 3 V

Supports a minimum supply voltage of 3 V for consistent operation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures performance in various environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for usage in extreme cold conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good electrical conductivity and solderability.

Terminal Position: DUAL

Dual terminal position allows for flexibility in mounting and connections.

Maximum Seated Height: 1.753 mm

Low maximum seated height of 1.753 mm saves space in electronic assemblies.

Width: 3.899 mm

Narrow width of 3.899 mm enables placement in tight spaces.

Differential Output: YES

Differential output ensures high noise immunity and reliable data transmission.

Length: 4.902 mm

Short length of 4.902 mm aids in compact system integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Maximum Receive Delay: 7.5 ns

Low receive delay of 7.5 ns enhances overall transmission speed and efficiency.

Terminal Form: GULL WING

Gull wing terminal form enables easy surface mount soldering for secure connections.

Interface Standard: EIA-899; TIA-899

Complies with industry standards for seamless integration and interoperability.

Input Characteristics: STANDARD

Standard input characteristics ensure compatibility with various signal sources.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3 V offers a stable operating voltage for consistent performance.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27 mm provides adequate spacing for soldering and routing signals.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type enables data transmission between different systems efficiently.

Technical Specifications

Line Drivers & Receivers DS91D176TMA attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-899; TIA-899

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.902 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Receive Delay:

7.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.753 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

5 ns

Width:

3.899 mm

Trade Compliance

DS91D176TMA Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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