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DS91C176TMAX

Texas Instruments

DS91C176TMAX by Texas Instruments

DS91C176TMAX by Texas Instruments is a CMOS Line Transceiver with 8 terminals, operating at 3.3V. It offers differential output and input characteristics, with max transmit delay of 5ns and receive delay of 7.5ns. Ideal for industrial applications requiring EIA-899/TIA-899 interface standard compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,464 parts In-Stock

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Digiode

USA . 2,943 parts In-Stock

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Anansix

USA . 235 parts In-Stock

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AZTECH Wire

Italy . 831 parts In-Stock

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$8.648

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831

$8.648

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Parana Technologies

USA . 1,679 parts In-Stock

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$13.241

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$13.748

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$13.748

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DigiPath Technology Company

USA . 2,013 parts In-Stock

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$14.580

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$13.414

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IDEA Electronic Components Group

UK . 646 parts In-Stock

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$14.878

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$14.134

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$13.390

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646

$14.878

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$13.390

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ChromeModa Solutions

Germany . 1 parts In-Stock

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$14.878

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$12.200

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1

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One Stop Electronics

USA . 770 parts In-Stock

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$15.500

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QUARKTWIN TECHNOLOGY LTD

USA . 12,350 parts In-Stock

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Lixinc

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Metaverse IC Inc.

Canada . 1,041 parts In-Stock

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Native Components

USA . 849 parts In-Stock

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Corphita

USA . 665 parts In-Stock

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Microchip USA

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Northwest PG Solutions

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Overview

Enhance your communication systems with the DS91C176TMAX by Texas Instruments, a top-tier manufacturer known for their quality and reliability. As a versatile Line Driver & Receiver, this product offers seamless integration, fast transmission speeds, and low power consumption. Whether you're working in industrial automation, telecommunications, or automotive applications, this compact and efficient device delivers unmatched value and performance. Upgrade your projects with the DS91C176TMAX and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external factors, ensuring longevity of the product.

Maximum Supply Voltage: 3.6 V

Supports a high maximum supply voltage, making it suitable for a wide range of applications.

Maximum Transmit Delay: 5 ns

Low transmit delay ensures fast and efficient data transmission.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the product to function in various environmental conditions.

Maximum Output Low Current: 8 Amp

Capability to handle high output current ensures reliable performance.

Differential Output: YES

Differential output helps in reducing noise and interference, resulting in improved signal quality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.

Interface Standard: EIA-899; TIA-899

Compliance with industry standards ensures compatibility and interoperability with a wide range of systems.

Technical Specifications

Line Drivers & Receivers DS91C176TMAX attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.000015 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-899; TIA-899

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.48 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

7.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

29.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Maximum Transmit Delay:

5 ns

Width:

3.9 mm

Trade Compliance

DS91C176TMAX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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