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DS90UH940NTNKDTQ1

Texas Instruments

DS90UH940NTNKDTQ1 by Texas Instruments

DS90UH940NTNKDTQ1 by Texas Instruments is a Line Receiver IC with 2 functions, operating at -40 to 105°C. It has a supply voltage range of 1.14-3.6V and features differential Schmitt trigger input characteristics. This industrial-grade chip carrier is suitable for automotive applications due to its AEC-Q100 screening level and compact size (9x9mm).

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,786 parts In-Stock

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3,786

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Digiode

USA . 1,613 parts In-Stock

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Chip Stock

USA . 205 parts In-Stock

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205

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Parana Technologies

USA . 2,223 parts In-Stock

1+ parts

$3.666

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$4.172

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$3.666

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$4.172

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DigiPath Technology Company

USA . 2,028 parts In-Stock

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$4.037

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$3.714

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$4.037

$3.714

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ChromeModa Solutions

Germany . 2,078 parts In-Stock

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$4.119

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$3.378

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$3.378

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IDEA Electronic Components Group

UK . 568 parts In-Stock

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$4.119

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$3.707

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568

$4.119

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$3.707

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Native Components

USA . 623 parts In-Stock

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$6.628

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623

$6.628

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AZTECH Wire

Italy . 799 parts In-Stock

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$13.256

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$13.256

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One Stop Electronics

USA . 1,626 parts In-Stock

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$27.500

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Corphita

USA . 2,326 parts In-Stock

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Microchip USA

USA . 1,848 parts In-Stock

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Northwest PG Solutions

USA . 225 parts In-Stock

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$6.495

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Overview

Experience unmatched quality and reliability with the DS90UH940NTNKDTQ1 by Texas Instruments, a leading manufacturer in the industry. As a cutting-edge line driver and receiver, this product offers a wide range of applications and is designed to meet the highest standards for performance and durability. With its advanced features and innovative technology, customers can expect seamless connectivity and enhanced functionality. Trust Texas Instruments to deliver superior products that provide value, benefits, and advantages to meet all your needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient PCB assembly without the need for additional components like sockets.

Maximum Supply Voltage: 3.6 V

Can handle a wide range of input voltages, providing flexibility in different applications.

No. of Functions: 2

Provides multiple functionalities in a single package, saving space and cost.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance.

Package Shape: SQUARE

Compact design for efficient use of board space.

Maximum Operating Temperature: 105 °C

Can operate reliably in high-temperature environments.

Nominal Supply Voltage: 3.3 V

Stable voltage supply for consistent performance.

Technical Specifications

Line Drivers & Receivers DS90UH940NTNKDTQ1 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Receiver No. of Bits:

2

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

1.26 V

Minimum Supply Voltage-1:

1.14 V

Nominal Supply Voltage-1:

1.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

DS90UH940NTNKDTQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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