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DS90UB962WRTDTQ1

Texas Instruments

DS90UB962WRTDTQ1 by Texas Instruments

DS90UB962WRTDTQ1 by Texas Instruments is a 64-terminal line driver with 4 functions. It operates at -40 to 105°C, with a supply voltage range of 1.71-1.89V. Ideal for industrial applications requiring differential Schmitt trigger input characteristics in a compact chip carrier package.

Median Price

$19.154

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,316 parts In-Stock

1+ parts

$15.737

100+ parts

$13.746

1k+ parts

$9.480

10k+ parts

-

3,316

$15.737

$13.746

$9.480

-

Mouser Electronics

USA . 293 parts In-Stock

1+ parts

$22.570

100+ parts

$16.740

1k+ parts

$14.950

10k+ parts

-

293

$22.570

$16.740

$14.950

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,401 parts In-Stock

1+ parts

$14.950

100+ parts

-

1k+ parts

-

10k+ parts

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4,401

$14.950

-

-

-

Chip Stock

USA . 17,300 parts In-Stock

1+ parts

-

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17,300

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-

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Vyrian

USA . 2,013 parts In-Stock

1+ parts

-

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2,013

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-

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

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-

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300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 472 parts In-Stock

1+ parts

$6.375

100+ parts

-

1k+ parts

$7.123

10k+ parts

-

472

$6.375

-

$7.123

-

ChromeModa Solutions

Germany . 6,805 parts In-Stock

1+ parts

$7.163

100+ parts

$5.874

1k+ parts

-

10k+ parts

-

6,805

$7.163

$5.874

-

-

IDEA Electronic Components Group

UK . 1,305 parts In-Stock

1+ parts

$7.163

100+ parts

-

1k+ parts

$6.447

10k+ parts

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1,305

$7.163

-

$6.447

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Corphita

USA . 194 parts In-Stock

1+ parts

$14.163

100+ parts

-

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-

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194

$14.163

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-

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Ampacity Inc.

Singapore . 1,571 parts In-Stock

1+ parts

$29.110

100+ parts

-

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10k+ parts

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1,571

$29.110

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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2,000

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-

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Lixinc

USA . 1,017 parts In-Stock

1+ parts

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1,017

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DigiPath Technology Company

USA . 490 parts In-Stock

1+ parts

-

100+ parts

$6.458

1k+ parts

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10k+ parts

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490

-

$6.458

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

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50

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Overview

Discover the high-quality DS90UB962WRTDTQ1 by Texas Instruments, a top-of-the-line line driver and receiver designed for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, this product offers unmatched reliability and performance. Ideal for industrial use, this chip carrier package with a very thin profile is perfect for demanding environments. Experience the value and benefits of this innovative solution, providing customers with superior connectivity and efficiency. Choose Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product, making it suitable for various industrial applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs, increasing efficiency in assembly processes.

Maximum Supply Voltage: 1.89 V

The high maximum supply voltage capability ensures stable and consistent performance under varying voltage conditions.

No. of Functions: 4

Having multiple functions integrated into one device simplifies circuit design and reduces the need for additional components, saving costs.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high quality and reliability, making the product suitable for automotive applications where robustness is essential.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows the product to operate efficiently in harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures enables the product to function effectively in both extreme cold and hot conditions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of high-quality terminal finish enhances conductivity and corrosion resistance, ensuring long-term reliability and performance.

Receiver No. of Bits: 4

The 4-bit receiver allows for accurate data transmission and reception, suitable for applications requiring precision communication.

Technical Specifications

Line Drivers & Receivers DS90UB962WRTDTQ1 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO HAS SUPPLY VOLTAGE RANGING FROM 1.045 TO 1.155V

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Receiver No. of Bits:

4

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage-1:

1.89 V

Minimum Supply Voltage-1:

1.71 V

Nominal Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

DS90UB962WRTDTQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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