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DS90UB635TRHBTQ1

Texas Instruments

DS90UB635TRHBTQ1 by Texas Instruments

DS90UB635TRHBTQ1 by Texas Instruments is a 32-terminal line driver with differential output and Schmitt trigger input. It operates at -40 to 105 °C, with max supply voltage of 1.89 V and peak reflow temp of 260 °C. Ideal for automotive applications requiring high-speed data transmission in compact spaces.

Median Price

$7.907

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,993 parts In-Stock

1+ parts

$6.514

100+ parts

$5.310

1k+ parts

$3.540

10k+ parts

-

9,993

$6.514

$5.310

$3.540

-

DigiKey

USA . 260 parts In-Stock

1+ parts

$9.300

100+ parts

$6.157

1k+ parts

$5.643

10k+ parts

$5.500

260

$9.300

$6.157

$5.643

$5.500

Mouser Electronics

USA . 232 parts In-Stock

1+ parts

$9.300

100+ parts

$6.160

1k+ parts

$5.430

10k+ parts

-

232

$9.300

$6.160

$5.430

-

Chip1Stop

Japan . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.278

10k+ parts

-

750

-

-

$4.278

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,960 parts In-Stock

1+ parts

$6.188

100+ parts

-

1k+ parts

-

10k+ parts

-

3,960

$6.188

-

-

-

Vyrian

USA . 5,944 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,944

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,483 parts In-Stock

1+ parts

$3.640

100+ parts

-

1k+ parts

-

10k+ parts

-

2,483

$3.640

-

-

-

Semicontronic

India . 2,369 parts In-Stock

1+ parts

$3.640

100+ parts

$3.549

1k+ parts

$3.531

10k+ parts

-

2,369

$3.640

$3.549

$3.531

-

Corohmni

South Africa . 244 parts In-Stock

1+ parts

$4.278

100+ parts

-

1k+ parts

-

10k+ parts

-

244

$4.278

-

-

-

Corphita

USA . 4,215 parts In-Stock

1+ parts

$5.863

100+ parts

-

1k+ parts

-

10k+ parts

-

4,215

$5.863

-

-

-

Northwest PG Solutions

USA . 1,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,200

-

-

-

-

Native Components

USA . 203 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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203

-

-

-

-

Overview

Experience the unmatched quality and reliability of the DS90UB635TRHBTQ1 by Texas Instruments, a cutting-edge line driver that sets the standard in the industry. Perfect for a wide range of applications, this innovative product boasts superior performance and efficiency. With Texas Instruments' renowned expertise in semiconductor manufacturing, you can trust that this line driver delivers exceptional value and benefits to meet your needs. Upgrade your systems with the DS90UB635TRHBTQ1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight construction for easy handling and installation.

Surface Mount: YES

Allows for efficient PCB mounting and saves space in the overall design.

Maximum Supply Voltage: 1.89 V

Ideal for low power applications and ensures safe operation within specified voltage limits.

No. of Functions: 4

Offers multiple versatile functions in a single device, reducing the need for additional components.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance in harsh environmental conditions.

Package Shape: SQUARE

Provides a compact and uniform shape for easy integration into circuit designs.

No. of Terminals: 32

Allows for versatile connectivity options and compatibility with various system configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers a variety of package styles to suit different mounting requirements and heat dissipation needs.

Maximum High Level Input Current: 0.00001 Amp

Ensures minimal power consumption and efficient operation in low power circuits.

Minimum Supply Voltage: 1.71 V

Provides a stable operating voltage range for reliable performance in different applications.

Maximum Operating Temperature: 105 °C

Can withstand high temperature environments without compromising performance or reliability.

Output Characteristics: OPEN-DRAIN

Offers an open-drain output configuration for flexible interfacing with other devices and systems.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without any impact on functionality or performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and high conductivity for reliable signal transmission.

Terminal Position: QUAD

Facilitates easy connection and installation in compact circuit layouts.

Maximum Seated Height: 1 mm

Low profile design for space-constrained applications and PCB layouts.

Width: 5 mm

Compact width for efficient integration into circuit designs and space-saving layouts.

Maximum Output Low Current: 4 Amp

Capable of driving high current loads for robust signal transmission and handling capabilities.

Differential Output: YES

Provides differential outputs for improved noise immunity and signal integrity in communication systems.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow processes during assembly without affecting performance.

Length: 5 mm

Compact length for space-efficient circuit layouts and designs.

Minimum Out Swing: 1.04 V

Ensures reliable signal swings for accurate data transmission in various applications.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly and RoHS compliant designs.

Maximum Supply Current: 225 mA

Capable of handling higher supply currents for robust performance in demanding applications.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Utilizes differential Schmitt trigger inputs for noise immunity and signal conditioning capabilities.

Nominal Supply Voltage: 1.8 V

Optimal nominal supply voltage for efficient performance and power consumption.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact connectivity and PCB layout requirements.

Driver No. of Bits: 4

Provides 4-bit driver functionality for versatile signal processing and control capabilities.

Moisture Sensitivity Level (MSL): 3

Ensures moisture resistance and reliability in humid environments or during storage.

Interface IC Type: LINE DRIVER

Designed as a line driver interface IC for signal conditioning and transmission in communication systems.

Technical Specifications

Line Drivers & Receivers DS90UB635TRHBTQ1 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

32

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.04 V

Output Characteristics:

OPEN-DRAIN

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

225 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

DS90UB635TRHBTQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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