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DS64BR401SQ

Texas Instruments

DS64BR401SQ by Texas Instruments

DS64BR401SQ by Texas Instruments is a Line Transceiver with 4 functions, 4-bit driver and receiver. It operates at -10 to 85 °C with supply voltage range of 2.375-2.625 V. Ideal for applications requiring differential input characteristics and low transmit/receive delay of 0.25 ns in compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,681 parts In-Stock

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Digiode

USA . 2,326 parts In-Stock

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Anansix

USA . 246 parts In-Stock

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Parana Technologies

USA . 1,895 parts In-Stock

1+ parts

$9.292

100+ parts

$862.866

1k+ parts

$8.362

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1,895

$9.292

$862.866

$8.362

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DigiPath Technology Company

USA . 1,029 parts In-Stock

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$10.231

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$10.231

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ChromeModa Solutions

Germany . 5,329 parts In-Stock

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$10.440

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$8.561

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$10.440

$8.561

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IDEA Electronic Components Group

UK . 1,810 parts In-Stock

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$10.440

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$9.918

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$9.396

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$10.440

$9.918

$9.396

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AZTECH Wire

Italy . 766 parts In-Stock

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$15.863

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One Stop Electronics

USA . 1,269 parts In-Stock

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$32.500

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$32.500

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A-Z Elektronik GmbH

Germany . 6,014 parts In-Stock

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Lixinc

USA . 5,618 parts In-Stock

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Corphita

USA . 4,301 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,009 parts In-Stock

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Kepictronics

USA . 386 parts In-Stock

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Northwest PG Solutions

USA . 305 parts In-Stock

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Native Components

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Overview

Elevate your communication network with the DS64BR401SQ by Texas Instruments. As a leader in line drivers & receivers, Texas Instruments delivers unparalleled quality and performance. This versatile chip carrier offers 4 functions, a very thin profile, and differential output for seamless data transmission. With a wide operating temperature range and low supply voltage requirements, this innovative solution is ideal for a variety of applications. Enhance your system reliability and efficiency with the DS64BR401SQ – the ultimate choice for your connectivity needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes installation and assembly easier, saving time and effort.

Maximum Supply Voltage: 2.625 V

Operates efficiently within a specified voltage range, ensuring stability and reliability.

No. of Functions: 4

Provides multiple functions in a single device, reducing the need for additional components.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and space-saving design, suitable for applications with limited space.

Maximum Transmit Delay: 0.25 ns

Low transmit delay ensures fast and efficient data transmission, critical for real-time applications.

No. of Terminals: 54

High number of terminals allows for versatile connectivity options and integration with other systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer flexibility in installation and thermal management, catering to diverse application needs.

Minimum Supply Voltage: 2.375 V

Operational at low voltage levels, increasing energy efficiency and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, ensuring performance in harsh environments.

Minimum Operating Temperature: -10 °C

Capable of functioning in low-temperature conditions, suitable for a wide range of operating environments.

Terminal Position: QUAD

Quad terminals provide stable and secure connections, reducing the risk of signal loss or interference.

Maximum Seated Height: 0.8 mm

Low profile design allows for compact mounting and integration in small devices or systems.

Width: 5.5 mm

Narrow width makes it suitable for space-constrained applications, optimizing layout and design.

Receiver No. of Bits: 4

4-bit receiver allows for precise data reception and signal processing, ensuring accuracy in communication.

Differential Output: YES

Differential output reduces noise and signal distortion, improving signal integrity and quality.

Length: 10 mm

Compact length makes it suitable for applications with space limitations, enabling efficient integration.

Maximum Receive Delay: 0.25 ns

Low receive delay ensures minimal latency in data reception, enhancing overall system performance.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental standards and promotes sustainability.

Input Characteristics: DIFFERENTIAL

Differential input allows for noise rejection and improved signal quality, enhancing overall system performance.

Nominal Supply Voltage: 2.5 V

Optimal supply voltage for stable and efficient operation, ensuring consistency in performance.

Terminal Pitch: 0.5 mm

Fine pitch terminals facilitate high-density mounting, maximizing connectivity in a limited space.

Driver No. of Bits: 4

4-bit driver ensures accurate and efficient signal transmission, meeting the requirements of complex data protocols.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, suitable for applications with controlled environments.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type supports bidirectional data transmission, enabling communication between different systems or devices.

Technical Specifications

Line Drivers & Receivers DS64BR401SQ attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-XQCC-N54

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Receive Delay:

.25 ns

Receiver No. of Bits:

4

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Transmit Delay:

.25 ns

Width:

5.5 mm

Trade Compliance

DS64BR401SQ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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