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DS64BR401SQE

Texas Instruments

DS64BR401SQE by Texas Instruments

DS64BR401SQE by Texas Instruments is a Line Transceiver with 4-bit driver and receiver functions. It operates at 2.375-2.625 V, with 0.25 ns transmit/receive delay, suitable for applications requiring differential input/output characteristics in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,055 parts In-Stock

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Anansix

USA . 2,320 parts In-Stock

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Vyrian

USA . 2,123 parts In-Stock

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Bristol Electronics

USA . 750 parts In-Stock

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Dan-Mar Components

USA . 750 parts In-Stock

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750

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ACDS - Activité Composants Distribution Service

France . 250 parts In-Stock

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Flip Electronics

USA . 65 parts In-Stock

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Prism Electronics

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One Stop Electronics

USA . 192 parts In-Stock

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$0.500

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Parana Technologies

USA . 32 parts In-Stock

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$4.588

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$5.049

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DigiPath Technology Company

USA . 1,056 parts In-Stock

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$5.052

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ChromeModa Solutions

Germany . 3,829 parts In-Stock

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$5.155

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$4.227

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IDEA Electronic Components Group

UK . 54 parts In-Stock

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AZTECH Wire

Italy . 470 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

Germany . 3,433 parts In-Stock

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Corphita

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Northwest PG Solutions

USA . 1,263 parts In-Stock

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Kepictronics

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Native Components

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Experience the superior quality of Texas Instruments with the DS64BR401SQE Line Driver & Receiver. With its surface mount feature and advanced technology, this product offers exceptional performance and reliability. Ideal for a wide range of applications, this line driver & receiver is designed to meet your needs with precision and efficiency. Trust in Texas Instruments to deliver unmatched value and benefits to enhance your projects. Elevate your electronics with the DS64BR401SQE - the perfect choice for quality-driven customers.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on a printed circuit board, allowing for efficient and compact design.

Maximum Supply Voltage: 2.625 V

Provides a wide operating range, making it compatible with various power sources and systems.

No. of Functions: 4

Offers multiple functions in a single component, reducing the need for additional chips and simplifying circuit design.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit layouts and PCB designs.

Maximum Transmit Delay: 0.25 ns

Provides fast data transmission, suitable for high-speed communication applications.

No. of Terminals: 54

Offers a high number of terminals for connecting to various external components and devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style ensures efficient heat dissipation and compact size for space-constrained applications.

Minimum Supply Voltage: 2.375 V

Allows for operation in low voltage conditions, suitable for power-constrained environments.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ideal for industrial and automotive applications.

Minimum Operating Temperature: -10 °C

Operates reliably in low temperature conditions, suitable for outdoor and harsh environments.

Terminal Position: QUAD

The quad terminal position provides stability and ease of connection in the circuit layout.

Maximum Seated Height: 0.8 mm

The low profile design enhances space efficiency and enables compact electronic device manufacturing.

Width: 5.5 mm

Compact width size for easy integration into various electronic devices and circuit designs.

Receiver No. of Bits: 4

The 4-bit receiver offers sufficient data processing capability for efficient communication.

Differential Output: YES

Provides noise immunity and reliable signal transmission, crucial for high-speed communication systems.

Length: 10 mm

Moderate length for easy placement and integration in PCB layouts.

Maximum Receive Delay: 0.25 ns

Ensures minimal delay in receiving data signals, critical for real-time communication applications.

Terminal Form: NO LEAD

Leadless terminal form factor for modern and compact SMT assembly processes.

Input Characteristics: DIFFERENTIAL

Differential input configuration provides noise rejection and enhanced signal integrity for robust data transmission.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for reliable operation and compatibility with common power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connections and space-efficient PCB layouts.

Driver No. of Bits: 4

4-bit driver for efficient data transmission and processing in various communication protocols.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, suitable for standard manufacturing and handling procedures.

Interface IC Type: LINE TRANSCEIVER

Integrated line transceiver interface for seamless communication across different systems and protocols.

Technical Specifications

Line Drivers & Receivers DS64BR401SQE attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-XQCC-N54

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Receive Delay:

.25 ns

Receiver No. of Bits:

4

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Transmit Delay:

.25 ns

Width:

5.5 mm

Trade Compliance

DS64BR401SQE Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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