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DS0026CMM

Texas Instruments

DS0026CMM by Texas Instruments

DS0026CMM by Texas Instruments is a Clock Driver & Buffer with 2 functions. It operates b/w 0-70°C, suitable for commercial applications. This MOS technology device has a small outline package with 8 terminals and supports supply voltage from 10V to 20V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,476 parts In-Stock

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2,476

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Digiode

USA . 1,974 parts In-Stock

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1,974

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Anansix

USA . 1,823 parts In-Stock

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1,823

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 209 parts In-Stock

1+ parts

$5.160

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209

$5.160

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Native Components

USA . 511 parts In-Stock

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$7.410

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511

$7.410

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One Stop Electronics

USA . 477 parts In-Stock

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$8.000

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477

$8.000

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Parana Technologies

USA . 40 parts In-Stock

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$26.915

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$30.028

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40

$26.915

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$30.028

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DigiPath Technology Company

USA . 1,076 parts In-Stock

1+ parts

$29.637

100+ parts

$27.266

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1,076

$29.637

$27.266

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IDEA Electronic Components Group

UK . 1,911 parts In-Stock

1+ parts

$30.242

100+ parts

$28.730

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$27.218

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1,911

$30.242

$28.730

$27.218

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ChromeModa Solutions

Germany . 995 parts In-Stock

1+ parts

$30.242

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$24.798

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995

$30.242

$24.798

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Component Stockers USA

USA . 704 parts In-Stock

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$99.990

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704

$99.990

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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3,500

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Corphita

USA . 2,614 parts In-Stock

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Northwest PG Solutions

USA . 436 parts In-Stock

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$7.262

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436

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$7.262

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Microchip USA

USA . 349 parts In-Stock

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349

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Overview

Upgrade your clock driver with the Texas Instruments DS0026CMM! Manufactured by a trusted industry leader, this high-quality clock driver offers reliability and precision in a compact package. Perfect for a wide range of applications, this product provides customers with unparalleled value and performance. Say goodbye to timing issues and hello to seamless operations with the DS0026CMM. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during manufacturing.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals.

No. of Functions: 2

Having 2 functions in one device provides efficiency and saves space on the PCB.

Package Shape: SQUARE

Square package shape is compact and facilitates easy placement on the board.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline, thin profile, and shrink pitch package style saves space on the PCB and enhances overall design aesthetics.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality even in colder environments.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and connection options.

Maximum Seated Height: 1.09 mm

Low maximum seated height reduces the overall profile of the device, ideal for compact designs.

Width: 3 mm

Narrow width allows for efficient use of space on the PCB.

Minimum Supply Voltage (Vsup): 10 V

Low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Length: 3 mm

Compact length contributes to the overall small footprint of the device.

Temperature Grade: COMMERCIAL

Commercial-grade temperature performance meets standard industry requirements.

Technology: MOS

MOS technology offers high speed and efficient operation for clock driving applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and reliable connections.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for dense packing on the PCB.

Maximum Supply Voltage (Vsup): 20 V

High maximum supply voltage rating ensures compatibility with a variety of power sources.

Technical Specifications

Clock Drivers & Buffers DS0026CMM attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

DS00

Input Conditioning:

STANDARD

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

Logic IC Type:

No. of Functions:

2

No. of Inverted Outputs:

1

No. of Terminals:

8

No. of True Outputs:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.09 mm

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

DS0026CMM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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