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DS0026CMA

Texas Instruments

DS0026CMA by Texas Instruments

DS0026CMA by Texas Instruments is a Clock Driver & Buffer with 2 functions. It operates b/w 0-70°C, suitable for commercial applications. With a small outline package style, it has a terminal pitch of 1.27mm and supports supply voltage from 10-20V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,617 parts In-Stock

1+ parts

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8,617

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Anansix

USA . 2,833 parts In-Stock

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2,833

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Digiode

USA . 1,834 parts In-Stock

1+ parts

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1,834

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 945 parts In-Stock

1+ parts

$0.868

100+ parts

-

1k+ parts

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945

$0.868

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Northwest PG Solutions

USA . 695 parts In-Stock

1+ parts

$0.955

100+ parts

-

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695

$0.955

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One Stop Electronics

USA . 214 parts In-Stock

1+ parts

$4.000

100+ parts

-

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214

$4.000

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Andel Nordic

Denmark . 4,133 parts In-Stock

1+ parts

$6.535

100+ parts

-

1k+ parts

$6.274

10k+ parts

$6.274

4,133

$6.535

-

$6.274

$6.274

AZTECH Wire

Italy . 322 parts In-Stock

1+ parts

$6.688

100+ parts

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322

$6.688

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Parana Technologies

USA . 242 parts In-Stock

1+ parts

$7.472

100+ parts

-

1k+ parts

$7.961

10k+ parts

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242

$7.472

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$7.961

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DigiPath Technology Company

USA . 413 parts In-Stock

1+ parts

$8.228

100+ parts

$7.570

1k+ parts

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413

$8.228

$7.570

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ChromeModa Solutions

Germany . 6,433 parts In-Stock

1+ parts

$8.396

100+ parts

$6.885

1k+ parts

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6,433

$8.396

$6.885

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IDEA Electronic Components Group

UK . 1,336 parts In-Stock

1+ parts

$8.396

100+ parts

$7.976

1k+ parts

$7.556

10k+ parts

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1,336

$8.396

$7.976

$7.556

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Corphita

USA . 3,523 parts In-Stock

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3,523

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Kepictronics

USA . 200 parts In-Stock

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200

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Overview

Enhance your electronic designs with the DS0026CMA clock driver and buffer by Texas Instruments. Known for their top-notch quality and innovative solutions, Texas Instruments delivers a product that is sure to exceed your expectations. Ideal for a wide range of applications in the clock drivers & buffers category, this versatile component offers unmatched value and benefits to customers. With its small outline package style and standard input conditioning, the DS0026CMA is a reliable choice for your next project. Upgrade your designs today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and making assembly more efficient.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making it versatile for different applications.

No. of Functions: 2

Having two functions in one package adds value and functionality to the product, offering more flexibility in design.

Package Shape: RECTANGULAR

Rectangular shape makes the product easy to handle and fit into standard designs.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options for connecting to other components or devices.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board and enables compact designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can operate efficiently in various environmental conditions.

Minimum Operating Temperature: 0 °C

The product can also function effectively at low temperatures, ensuring versatility and reliability in different settings.

Terminal Position: DUAL

Dual terminal position allows for easier connections and enhances overall usability.

Maximum Seated Height: 1.753 mm

Low maximum seated height contributes to a compact overall design and facilitates space-saving in applications.

Width: 3.9 mm

Narrow width makes the product suitable for compact designs where space is limited.

Minimum Supply Voltage (Vsup): 10 V

Low minimum supply voltage requirement ensures compatibility with a variety of power sources.

Length: 4.9 mm

Short length helps in space-saving and allows for flexible placement on the circuit board.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates the product is suitable for standard commercial use.

Technology: MOS

MOS technology offers high performance and efficiency in signal processing.

Terminal Form: GULL WING

Gull wing terminal form provides reliable solder joint connections and ease of installation.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27mm ensures compatibility with commonly used connectors and sockets.

Maximum Supply Voltage (Vsup): 20 V

High maximum supply voltage capability allows for flexibility in power supply options and compatibility with various systems.

Technical Specifications

Clock Drivers & Buffers DS0026CMA attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

DS00

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Logic IC Type:

No. of Functions:

2

No. of Inverted Outputs:

1

No. of Terminals:

8

No. of True Outputs:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.753 mm

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

DS0026CMA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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