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DRV8704DCP

Texas Instruments

DRV8704DCP by Texas Instruments

DRV8704DCP by Texas Instruments is a Motion Control IC with 38 terminals, operating at -40 to 85°C. It features a supply voltage range of 1.7-1.9V and terminal finish in nickel palladium gold. Ideal for stepper motor control applications due to its compact size and industrial temperature grade suitability.

Median Price

$3.710

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 850 parts In-Stock

1+ parts

$2.460

100+ parts

$2.410

1k+ parts

$2.360

10k+ parts

-

850

$2.460

$2.410

$2.360

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Texas Instruments

USA . 1,400 parts In-Stock

1+ parts

$3.710

100+ parts

-

1k+ parts

-

10k+ parts

-

1,400

$3.710

-

-

-

DigiKey

USA . 373 parts In-Stock

1+ parts

$5.130

100+ parts

$3.275

1k+ parts

$3.115

10k+ parts

-

373

$5.130

$3.275

$3.115

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,933 parts In-Stock

1+ parts

$3.524

100+ parts

-

1k+ parts

-

10k+ parts

-

1,933

$3.524

-

-

-

Chip Stock

USA . 18,106 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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18,106

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Vyrian

USA . 4,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,592

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 773 parts In-Stock

1+ parts

$3.150

100+ parts

-

1k+ parts

-

10k+ parts

-

773

$3.150

-

-

-

Semicontronic

India . 657 parts In-Stock

1+ parts

$3.150

100+ parts

$3.071

1k+ parts

$3.056

10k+ parts

-

657

$3.150

$3.071

$3.056

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Northwest PG Solutions

USA . 930 parts In-Stock

1+ parts

$3.166

100+ parts

-

1k+ parts

-

10k+ parts

-

930

$3.166

-

-

-

Corphita

USA . 4,618 parts In-Stock

1+ parts

$3.339

100+ parts

-

1k+ parts

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10k+ parts

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4,618

$3.339

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-

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Corohmni

South Africa . 395 parts In-Stock

1+ parts

$3.710

100+ parts

-

1k+ parts

-

10k+ parts

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395

$3.710

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-

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Parana Technologies

USA . 2,146 parts In-Stock

1+ parts

$12.298

100+ parts

-

1k+ parts

$12.730

10k+ parts

-

2,146

$12.298

-

$12.730

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DigiPath Technology Company

USA . 166 parts In-Stock

1+ parts

$13.542

100+ parts

$12.458

1k+ parts

-

10k+ parts

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166

$13.542

$12.458

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IDEA Electronic Components Group

UK . 2,323 parts In-Stock

1+ parts

$13.818

100+ parts

$13.127

1k+ parts

$12.436

10k+ parts

-

2,323

$13.818

$13.127

$12.436

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ChromeModa Solutions

Germany . 1,420 parts In-Stock

1+ parts

$13.818

100+ parts

$11.331

1k+ parts

-

10k+ parts

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1,420

$13.818

$11.331

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QUARKTWIN TECHNOLOGY LTD

USA . 24,923 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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24,923

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Native Components

USA . 231 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.792

10k+ parts

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231

-

-

$2.792

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Overview

Discover the DRV8704DCP by Texas Instruments, a top-of-the-line motion control IC designed to deliver unparalleled performance and reliability. With Texas Instruments' renowned reputation for quality, this product offers exceptional value and benefits to customers in various industries. From precise stepper motor control to efficient power management, this compact device is the perfect solution for your application needs. Trust Texas Instruments to provide cutting-edge technology that meets the highest standards of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for various environments.

Surface Mount: YES

Easier and more efficient assembly process, saving time and reducing production costs.

Nominal Supply Voltage (Vsup): 1.8 V

Optimal voltage level for efficient performance and power consumption.

Maximum Operating Temperature: 85 °C

Allows the product to function reliably in high temperature environments.

Maximum Seated Height: 1.2 mm

Low profile design saves space and allows for more compact system integration.

Width (mm): 4.4 mm

Small form factor enables flexibility in placement and installation within a system.

Minimum Supply Voltage (Vsup): 1.7 V

Wide range of supply voltage tolerance ensures compatibility with various power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Soldering process is quick and efficient, reducing manufacturing time.

Terminal Form: GULL WING

Facilitates easy and secure soldering to the circuit board during assembly.

Maximum Supply Voltage (Vsup): 1.9 V

Provides a safety margin for the supply voltage, protecting the product from potential damage.

Technical Specifications

Motion Control ICs DRV8704DCP attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Current (Isup):

22 mA

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

DRV8704DCP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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