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DRV8332HDDV

Texas Instruments

DRV8332HDDV by Texas Instruments

DRV8332HDDV by Texas Instruments is a Motion Control IC with 44 terminals, operating voltage range of 10.8-50V, and max output current of 13A. Ideal for BRUSH DC MOTOR CONTROL applications, it features a MILITARY-grade temp rating and GULL WING terminal form for high reliability in harsh environments.

Median Price

$312.804

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,659 parts In-Stock

1+ parts

$209.658

100+ parts

$174.715

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6,659

$209.658

$174.715

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Mouser Electronics

USA . 87 parts In-Stock

1+ parts

$415.950

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87

$415.950

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Distributors (In-Stock)

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Digiode

USA . 4,547 parts In-Stock

1+ parts

$199.175

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4,547

$199.175

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Nova Conductors

Japan . 100 parts In-Stock

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$207.900

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100

$207.900

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Vyrian

USA . 4,199 parts In-Stock

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4,199

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Chip Stock

USA . 200 parts In-Stock

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200

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Distributors (Availability)

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Parana Technologies

USA . 222 parts In-Stock

1+ parts

$7.512

100+ parts

-

1k+ parts

$8.020

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222

$7.512

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$8.020

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DigiPath Technology Company

USA . 1,726 parts In-Stock

1+ parts

$8.272

100+ parts

$7.610

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1,726

$8.272

$7.610

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ChromeModa Solutions

Germany . 3,652 parts In-Stock

1+ parts

$8.441

100+ parts

$6.922

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3,652

$8.441

$6.922

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IDEA Electronic Components Group

UK . 902 parts In-Stock

1+ parts

$8.441

100+ parts

$8.019

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$7.597

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902

$8.441

$8.019

$7.597

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Ampacity Inc.

Singapore . 1,791 parts In-Stock

1+ parts

$178.210

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1,791

$178.210

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Corphita

USA . 2,098 parts In-Stock

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$188.692

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2,098

$188.692

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Aranea Global

USA . 500 parts In-Stock

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$203.742

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$195.592

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500

$203.742

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$195.592

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Microchip USA

USA . 2,094 parts In-Stock

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Overview

Experience seamless motion control with the DRV8332HDDV by Texas Instruments, a leader in cutting-edge technology. This Motion Control IC is designed for superior performance and reliability, making it the ideal choice for a wide range of applications. Its compact package and high-quality materials ensure durability and efficiency, while the advanced features provide precise motor control. Take your projects to the next level with the DRV8332HDDV and enjoy the benefits of top-notch engineering and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for a variety of applications.

Nominal Supply Voltage (Vsup): 50 V

A high supply voltage allows for efficient operation and compatibility with a wide range of power sources.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and prolonged use without overheating.

Width (mm): 6.1 mm

The compact width of the package allows for easy integration into tight spaces or applications where size is a concern.

Temperature Grade: MILITARY

With a military-grade temperature rating, this product is designed to meet stringent performance and reliability standards, making it suitable for mission-critical applications.

Technical Specifications

Motion Control ICs DRV8332HDDV attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

13 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

52.5 V

Minimum Supply Voltage (Vsup):

10.8 V

Nominal Supply Voltage (Vsup):

50 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6.1 mm

Trade Compliance

DRV8332HDDV Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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