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DRV2624YFFT

Texas Instruments

DRV2624YFFT by Texas Instruments

DRV2624YFFT by Texas Instruments is a rectangular-shaped IC with 9 terminals, operating at -40 to 85°C. It has a nominal voltage of 2.7-5.5V and max output voltage of 11V, suitable for industrial applications requiring fine pitch grid array packages in compact designs.

Median Price

$1.432

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2 parts In-Stock

1+ parts

$0.854

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$0.854

-

-

-

Chip1Stop

Japan . 2 parts In-Stock

1+ parts

$1.070

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$1.070

-

-

-

Texas Instruments

USA . 53,680 parts In-Stock

1+ parts

$1.793

100+ parts

$1.379

1k+ parts

$0.726

10k+ parts

-

53,680

$1.793

$1.379

$0.726

-

DigiKey

USA . 508 parts In-Stock

1+ parts

$1.980

100+ parts

$1.186

1k+ parts

$1.056

10k+ parts

$0.980

508

$1.980

$1.186

$1.056

$0.980

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,985 parts In-Stock

1+ parts

$0.750

100+ parts

-

1k+ parts

-

10k+ parts

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1,985

$0.750

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-

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Vyrian

USA . 8,876 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,876

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 13,253 parts In-Stock

1+ parts

$0.670

100+ parts

$0.653

1k+ parts

$0.650

10k+ parts

-

13,253

$0.670

$0.653

$0.650

-

Ampacity Inc.

Singapore . 13,056 parts In-Stock

1+ parts

$0.670

100+ parts

-

1k+ parts

-

10k+ parts

-

13,056

$0.670

-

-

-

Corphita

USA . 2,993 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

-

10k+ parts

-

2,993

$0.710

-

-

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Corohmni

South Africa . 315 parts In-Stock

1+ parts

$0.789

100+ parts

-

1k+ parts

-

10k+ parts

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315

$0.789

-

-

-

Microchip USA

USA . 2,038 parts In-Stock

1+ parts

$9.532

100+ parts

-

1k+ parts

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10k+ parts

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2,038

$9.532

-

-

-

Parana Technologies

USA . 547 parts In-Stock

1+ parts

$12.858

100+ parts

-

1k+ parts

$13.337

10k+ parts

-

547

$12.858

-

$13.337

-

DigiPath Technology Company

USA . 1,613 parts In-Stock

1+ parts

$14.158

100+ parts

$13.025

1k+ parts

-

10k+ parts

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1,613

$14.158

$13.025

-

-

ChromeModa Solutions

Germany . 797 parts In-Stock

1+ parts

$14.447

100+ parts

$11.847

1k+ parts

-

10k+ parts

-

797

$14.447

$11.847

-

-

IDEA Electronic Components Group

UK . 573 parts In-Stock

1+ parts

$14.447

100+ parts

$13.725

1k+ parts

$13.002

10k+ parts

-

573

$14.447

$13.725

$13.002

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QUARKTWIN TECHNOLOGY LTD

USA . 17,642 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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17,642

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Lixinc

USA . 13,532 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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13,532

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,000

-

-

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Northwest PG Solutions

USA . 1,859 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,859

-

-

-

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Native Components

USA . 228 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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228

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-

Overview

Elevate your electronic designs with the DRV2624YFFT by Texas Instruments, a top-tier manufacturer renowned for cutting-edge technology. This innovative product falls under the category of Other Function Semiconductors, offering unparalleled quality and reliability. With a wide range of applications, this semiconductor is versatile and adaptable to meet various industry needs. Take advantage of its exceptional value, benefits, and advantages to elevate your projects to new heights. Experience the difference with Texas Instruments and DRV2624YFFT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protects the internal components of the semiconductor.

Surface Mount: YES

Being surface mount allows for easy and efficient installation on a circuit board, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 3.6 V

The nominal supply voltage of 3.6V ensures stable and consistent power delivery to the semiconductor for reliable performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade means this semiconductor can operate effectively in harsh environments with temperature fluctuations, making it versatile and robust.

Width (mm): 1.331 mm

The compact width of 1.331mm allows for space-saving installation in electronic devices with limited space, enhancing design flexibility.

Maximum Output Voltage: 11 V

The high maximum output voltage of 11V enables this semiconductor to support a wide range of applications, making it versatile and suitable for various electronic systems.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper ensures good electrical conductivity and corrosion resistance, contributing to the longevity and reliability of the semiconductor.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows this semiconductor to function efficiently even in elevated temperature environments, ensuring reliable performance in various conditions.

Technical Specifications

Other Function Semiconductors DRV2624YFFT attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B9

JESD-609 Code:

e1

Length:

1.468 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

11 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.331 mm

Trade Compliance

DRV2624YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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