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DMVA3AAAR

Texas Instruments

DMVA3AAAR by Texas Instruments

The Texas Instruments DMVA3AAAR microprocessor features 32-bit architecture, 28-bit address bus width, and 16mm width. It is suitable for applications requiring a max clock frequency of 30MHz, with integrated cache and low power mode for efficient performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,661 parts In-Stock

1+ parts

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3,661

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Digiode

USA . 1,818 parts In-Stock

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1,818

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 918 parts In-Stock

1+ parts

$3.086

100+ parts

-

1k+ parts

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10k+ parts

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918

$3.086

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AZTECH Wire

Italy . 829 parts In-Stock

1+ parts

$12.938

100+ parts

-

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829

$12.938

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Parana Technologies

USA . 613 parts In-Stock

1+ parts

$13.230

100+ parts

-

1k+ parts

$13.736

10k+ parts

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613

$13.230

-

$13.736

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DigiPath Technology Company

USA . 1,553 parts In-Stock

1+ parts

$14.568

100+ parts

$13.402

1k+ parts

-

10k+ parts

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1,553

$14.568

$13.402

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ChromeModa Solutions

Germany . 4,346 parts In-Stock

1+ parts

$14.865

100+ parts

$12.189

1k+ parts

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10k+ parts

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4,346

$14.865

$12.189

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IDEA Electronic Components Group

UK . 531 parts In-Stock

1+ parts

$14.865

100+ parts

$14.122

1k+ parts

$13.378

10k+ parts

-

531

$14.865

$14.122

$13.378

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One Stop Electronics

USA . 1,619 parts In-Stock

1+ parts

$27.000

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1,619

$27.000

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Microchip USA

USA . 1,208 parts In-Stock

1+ parts

$121.750

100+ parts

$119.630

1k+ parts

$118.580

10k+ parts

$117.520

1,208

$121.750

$119.630

$118.580

$117.520

Corphita

USA . 2,409 parts In-Stock

1+ parts

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2,409

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Component Stockers USA

USA . 1,317 parts In-Stock

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1,317

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Native Components

USA . 222 parts In-Stock

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$2.721

10k+ parts

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222

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$2.721

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Overview

Experience the next level of performance with the DMVA3AAAR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microprocessors that are ideal for a wide range of applications. From enhancing computing power to improving efficiency, this product offers customers unparalleled value and benefits. Upgrade your technology with the DMVA3AAAR and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the microprocessor, making it resistant to environmental factors and extending its lifespan.

Integrated Cache: YES

Having an integrated cache improves the performance of the microprocessor by reducing data access times and enhancing overall speed.

Surface Mount: YES

Being surface mountable makes the microprocessor easy to install on a circuit board, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.26 V

With a maximum supply voltage of 1.26 V, the microprocessor operates efficiently while still ensuring stable performance.

Address Bus Width: 28

The 28-bit address bus width allows for a large memory addressing range, enabling the microprocessor to handle complex calculations and data-heavy tasks.

Package Shape: SQUARE

The square package shape provides a compact design, making it suitable for space-constrained applications and allowing for efficient placement on a circuit board.

Bit Size: 32

With a 32-bit bit size, the microprocessor can process data in larger chunks, leading to faster execution of instructions and improved performance.

Power Supplies (V): 1.35

The 1.35V power supply ensures energy-efficient operation of the microprocessor, reducing power consumption and heat generation.

No. of Terminals: 609

Having 609 terminals allows for connectivity with a wide range of external devices, enhancing the versatility and compatibility of the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers a high level of packaging density, enabling a compact form factor and efficient heat dissipation.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14V ensures that the microprocessor can operate at lower power levels without compromising performance, making it energy-efficient.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term durability.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the installation process and allows for efficient heat dissipation, leading to improved overall performance.

Maximum Seated Height: 1.32 mm

The maximum seated height of 1.32 mm ensures compatibility with various enclosure designs, making the microprocessor suitable for a wide range of applications.

RAM Words: 262144

With 262,144 RAM words, the microprocessor can store and manipulate large amounts of data, facilitating multitasking and complex computing tasks.

Width: 16 mm

The 16mm width provides a compact form factor, allowing for easy integration into space-constrained electronic devices without sacrificing performance.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the microprocessor, ensuring reliable operation and reducing development time.

External Data Bus Width: 16

The 16-bit external data bus width allows for faster data transfer between the microprocessor and external devices, improving overall system performance.

Maximum Clock Frequency: 30 MHz

With a maximum clock frequency of 30 MHz, the microprocessor can execute instructions at high speeds, resulting in quick response times and seamless operation.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand peak reflow temperatures for up to 30 seconds ensures the reliability and durability of the microprocessor during the manufacturing process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for optimal soldering of the microprocessor onto a circuit board, ensuring secure connections and long-term reliability.

Length: 16 mm

The 16mm length contributes to the compact design of the microprocessor, making it suitable for small electronic devices and applications with limited space.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor enables high-speed processing of instructions and efficient use of resources, making it a reliable choice for performance-critical applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the microprocessor in various operating conditions.

Terminal Form: BALL

The terminal form of ball allows for easy installation and removal of the microprocessor, simplifying maintenance and upgrades for electronic devices.

Nominal Supply Voltage: 1.2 V

Having a nominal supply voltage of 1.2V ensures stable and efficient operation of the microprocessor, minimizing power consumption and heat generation.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm provides a high level of connectivity and compatibility with various circuit board designs, making the microprocessor versatile and easy to integrate.

Format: FLOATING POINT

Using a floating-point format allows for accurate and efficient processing of decimal numbers and complex mathematical operations, making the microprocessor suitable for scientific and computational tasks.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the microprocessor can withstand exposure to moderate humidity levels during manufacturing and storage, ensuring its reliability and performance.

Speed: 720 rpm

With a speed of 720 rpm, the microprocessor can effectively execute instructions and process data at a fast rate, contributing to smooth and responsive system operation.

Low Power Mode: YES

The low power mode feature allows the microprocessor to operate at reduced power levels when system demands are low, conserving energy and extending battery life in portable devices.

Technical Specifications

Microprocessors DMVA3AAAR attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B609

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

609

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA609,31X31,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.35

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

1.32 mm

Speed:

720 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DMVA3AAAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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