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DLPC4422ZPC

Texas Instruments

DLPC4422ZPC by Texas Instruments

DLPC4422ZPC by Texas Instruments is a MOSFET gate driver with 516 terminals, operating at 3.135-3.465 V. It features a grid array package style, suitable for commercial applications requiring a half bridge-based MOSFET driver with a temperature range of 0-55°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,470 parts In-Stock

1+ parts

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4,470

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Digiode

USA . 1,187 parts In-Stock

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1,187

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Distributors (Availability)

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AZTECH Wire

Italy . 660 parts In-Stock

1+ parts

$8.812

100+ parts

-

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660

$8.812

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Parana Technologies

USA . 2,370 parts In-Stock

1+ parts

$9.155

100+ parts

-

1k+ parts

$9.806

10k+ parts

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2,370

$9.155

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$9.806

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ChromeModa Solutions

Germany . 5,665 parts In-Stock

1+ parts

$10.286

100+ parts

$8.435

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5,665

$10.286

$8.435

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IDEA Electronic Components Group

UK . 941 parts In-Stock

1+ parts

$10.286

100+ parts

$9.772

1k+ parts

$9.257

10k+ parts

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941

$10.286

$9.772

$9.257

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One Stop Electronics

USA . 1,419 parts In-Stock

1+ parts

$15.500

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1,419

$15.500

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QUARKTWIN TECHNOLOGY LTD

USA . 20,097 parts In-Stock

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20,097

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Corphita

USA . 3,911 parts In-Stock

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3,911

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Northwest PG Solutions

USA . 2,343 parts In-Stock

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$3.430

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2,343

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$3.430

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DigiPath Technology Company

USA . 2,262 parts In-Stock

1+ parts

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100+ parts

$9.274

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2,262

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$9.274

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Native Components

USA . 242 parts In-Stock

1+ parts

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$3.395

10k+ parts

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242

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$3.395

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Overview

Experience the ultimate in efficiency and reliability with the DLPC4422ZPC by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality MOSFET Gate Drivers that are essential for a wide range of applications. With its advanced features and durable construction, this product offers unparalleled value, ensuring optimal performance and longevity. Whether you're in need of precise control in industrial automation or power management systems, the DLPC4422ZPC is the perfect solution to meet your needs. Trust Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while ensuring reliability.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.465 V

Provides a wide operating range, allowing for flexibility in voltage requirements for different applications.

Package Shape: SQUARE

Square shape helps in efficient use of space on the circuit board and enables easier alignment during assembly.

No. of Terminals: 516

High number of terminals allow for connection to multiple components and peripherals, expanding the product's versatility.

Package Style (Meter): GRID ARRAY

Grid array packaging offers better heat dissipation and electrical performance due to its compact design and increased density of connections.

Minimum Supply Voltage: 3.135 V

With a low minimum supply voltage, the product can operate efficiently even in low power scenarios, making it suitable for a wide range of applications.

Maximum Operating Temperature: 55 °C

High maximum operating temperature ensures reliability and stability even in harsh environmental conditions, making the product suitable for industrial applications.

Minimum Operating Temperature: 0 °C

Ability to function at low temperatures allows for use in a variety of environments, including refrigerated or outdoor settings.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connections, reducing the risk of interference with other components on the circuit board.

Maximum Seated Height: 2.42 mm

Low maximum seated height enables a compact design, reducing overall size and enhancing the product's compatibility with space-constrained applications.

Width: 27 mm

Optimal width provides a balance between size and functionality, making the product suitable for a range of applications without compromising on performance.

Length: 27 mm

Square shape with uniform length and width enhances symmetry and ease of installation, ensuring compatibility with standard circuit board layouts.

Temperature Grade: COMMERCIAL

Commercial-grade temperature performance is suitable for standard operating conditions, offering reliability and cost-effectiveness for a wide range of applications.

Terminal Form: BALL

Ball terminal form provides reliable and secure connections, ensuring stable performance and reducing the risk of signal loss or interference.

Nominal Supply Voltage: 3.3 V

Close match between nominal and maximum supply voltage allows for efficient and consistent operation within the specified voltage range, ensuring optimal performance.

Terminal Pitch: 1 mm

Compact terminal pitch enables high-density connections, maximizing space efficiency on the circuit board and facilitating streamlined assembly processes.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

Half bridge based MOSFET driver offers efficient control and switching capabilities for power MOSFETs, enhancing the product's performance in various power management applications.

Technical Specifications

MOSFET Gate Drivers DLPC4422ZPC attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

High Side Driver:

NO

Interface IC Type:

JESD-30 Code:

S-PBGA-B516

Length:

27 mm

No. of Functions:

1

No. of Terminals:

516

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.42 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Trade Compliance

DLPC4422ZPC Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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