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DLP1700FQA

Texas Instruments

DLP1700FQA by Texas Instruments

Texas Instruments DLP1700FQA is a ceramic, metal-sealed co-fired chip carrier with 46 terminals. Operating b/w 0-70°C, it requires 2.25-3.6V supply voltage for consumer circuit applications. With a compact size of 15.5x9mm and height of 4.383mm, it's ideal for various electronic devices requiring high-quality display solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,136 parts In-Stock

1+ parts

-

100+ parts

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6,136

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Digiode

USA . 2,773 parts In-Stock

1+ parts

-

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2,773

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 14 parts In-Stock

1+ parts

$0.602

100+ parts

-

1k+ parts

$1.680

10k+ parts

-

14

$0.602

-

$1.680

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IDEA Electronic Components Group

UK . 1,372 parts In-Stock

1+ parts

$0.676

100+ parts

-

1k+ parts

$0.608

10k+ parts

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1,372

$0.676

-

$0.608

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ChromeModa Solutions

Germany . 921 parts In-Stock

1+ parts

$0.676

100+ parts

$0.554

1k+ parts

-

10k+ parts

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921

$0.676

$0.554

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Native Components

USA . 202 parts In-Stock

1+ parts

$0.837

100+ parts

-

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202

$0.837

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Northwest PG Solutions

USA . 22 parts In-Stock

1+ parts

$0.921

100+ parts

-

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22

$0.921

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One Stop Electronics

USA . 724 parts In-Stock

1+ parts

$9.800

100+ parts

-

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724

$9.800

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AZTECH Wire

Italy . 669 parts In-Stock

1+ parts

$11.185

100+ parts

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669

$11.185

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Corphita

USA . 2,936 parts In-Stock

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2,936

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DigiPath Technology Company

USA . 1,708 parts In-Stock

1+ parts

-

100+ parts

$0.609

1k+ parts

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1,708

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$0.609

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Microchip USA

USA . 400 parts In-Stock

1+ parts

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400

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Overview

Unleash the power of cutting-edge technology with the Texas Instruments DLP1700FQA, a top-tier consumer IC that promises unparalleled performance and reliability. Crafted with precision and expertise by Texas Instruments, this chip carrier package boasts a ceramic, metal-sealed cofired body material for enhanced durability. With 46 terminals and a sleek rectangular shape, this innovative product is designed to excel in a wide range of applications. Elevate your projects with the DLP1700FQA's superior quality, seamless surface mount feature, and optimal operating temperature range. Say goodbye to limitations and hello to endless possibilities with this exceptional offering from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and protection for the IC, making it reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards.

Package Shape: RECTANGULAR

The rectangular shape makes the IC compatible with standard PCB designs and allows for efficient use of space.

No. of Terminals: 46

Having a high number of terminals provides versatility and options for connecting to various components in a circuit.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and high temperature operation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and efficient soldering onto the PCB.

Width: 9 mm

Compact width enables space-saving integration into electronic devices.

Minimum Supply Voltage (Vsup): 2.25 V

Low minimum supply voltage requirement allows for operation in low power applications.

Length: 15.5 mm

The moderate length offers a balance between compactness and functionality in circuit design.

Temperature Grade: COMMERCIAL

Suitable for commercial applications where temperature requirements are not extreme.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and is safer for handling.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage allows for operation in a wide range of applications without risk of damage.

Technical Specifications

Other Function Consumer ICs DLP1700FQA attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CBGA-N46

Length:

15.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

46

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

LGA

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.383 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.25 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

9 mm

Trade Compliance

DLP1700FQA General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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