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DIX4192IPFBT

Texas Instruments

DIX4192IPFBT by Texas Instruments

DIX4192IPFBT by Texas Instruments is a Line Transceiver with 48 terminals, operating at temperatures from -40 to 85°C. It features CMOS technology, differential output, and a max supply voltage of 3.6V. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,559 parts In-Stock

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Digiode

USA . 4,693 parts In-Stock

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Parana Technologies

USA . 821 parts In-Stock

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$11.841

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$12.242

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821

$11.841

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$12.242

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ChromeModa Solutions

Germany . 5,803 parts In-Stock

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$13.305

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$10.910

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IDEA Electronic Components Group

UK . 1,155 parts In-Stock

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$13.305

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$12.640

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$11.974

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$11.974

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AZTECH Wire

Italy . 569 parts In-Stock

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569

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One Stop Electronics

USA . 963 parts In-Stock

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$22.500

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Corphita

USA . 3,842 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Northwest PG Solutions

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DigiPath Technology Company

USA . 1,229 parts In-Stock

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Native Components

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Overview

Enhance your communication systems with the DIX4192IPFBT by Texas Instruments, a high-quality Line Driver & Receiver designed to meet the demands of industrial applications. With Texas Instruments' reputation for excellence in manufacturing, this product offers unmatched reliability and durability. Whether you're looking to improve data transmission or enhance signal integrity, this compact and versatile device provides the value and performance you need. Elevate your projects with the DIX4192IPFBT and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Facilitates easy installation and maintenance of the product.

Maximum Supply Voltage: 1.95 V

Efficiently handles high supply voltage ensuring proper functioning.

Package Shape: SQUARE

Square shape makes it easy to fit and integrate into various systems.

Maximum Supply Voltage-1: 3.6 V

Allows for a wide range of supply voltage, increasing compatibility with different systems.

No. of Terminals: 48

Provides multiple connection points for enhanced connectivity.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Sleek package style with fine pitch design saves space and enhances overall aesthetics.

Minimum Supply Voltage-1: 3 V

Can function efficiently even under low supply voltage conditions.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage requirement makes it energy-efficient.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments, increasing reliability.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, suitable for a range of applications.

Terminal Position: QUAD

Quad terminal position provides stability and secure connections.

Maximum Seated Height: 1.2 mm

Low seated height enhances space efficiency and allows for compact installations.

Width: 7 mm

Narrow width design saves space and facilitates integration into tight spaces.

Receiver No. of Bits: 4

4-bit receiver provides accurate data transmission and reception capabilities.

Differential Output: YES

Differential output helps reduce noise and improve signal quality.

Length: 7 mm

Compact length design for space-saving installations.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in tough environments.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time data transmission and reception.

Technology: CMOS

CMOS technology provides efficient and low-power consumption performance.

Terminal Form: GULL WING

Gull wing terminal form enhances stability and ease of soldering during installation.

Input Characteristics: STANDARD

Standard input characteristics ensure compatibility with a wide range of systems.

Nominal Supply Voltage: 1.8 V

Nominal supply voltage meets industry standards for reliable operation.

Terminal Pitch: 0.5 mm

Fine terminal pitch enhances connectivity and ease of installation.

Nominal Supply Voltage-1: 3.3 V

Nominal supply voltage-1 meets industry standards for reliable operation.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type ensures efficient data transmission and reception capabilities.

Technical Specifications

Line Drivers & Receivers DIX4192IPFBT attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

DIX4192IPFBT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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