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DIX4192IPFBRG4

Texas Instruments

DIX4192IPFBRG4 by Texas Instruments

DIX4192IPFBRG4 by Texas Instruments is a Line Driver & Receiver with 48 terminals, operating at -40 to 85 °C. It features a CMOS technology, TRUE output polarity, and differential output for industrial applications. With a max supply voltage of 3.6 V and surface mount capability, it offers reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,092 parts In-Stock

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Vyrian

USA . 1,903 parts In-Stock

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1,903

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Distributors (Availability)

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Native Components

USA . 785 parts In-Stock

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$5.570

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785

$5.570

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AZTECH Wire

Italy . 632 parts In-Stock

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$9.150

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632

$9.150

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Parana Technologies

USA . 2,333 parts In-Stock

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$10.044

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$932.705

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$9.039

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2,333

$10.044

$932.705

$9.039

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DigiPath Technology Company

USA . 1,688 parts In-Stock

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$11.059

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ChromeModa Solutions

Germany . 2,517 parts In-Stock

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$11.285

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$9.254

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$11.285

$9.254

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IDEA Electronic Components Group

UK . 549 parts In-Stock

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$11.285

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$10.721

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$10.156

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549

$11.285

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$10.156

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One Stop Electronics

USA . 1,311 parts In-Stock

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$26.500

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Perfect Parts

USA . 5,225 parts In-Stock

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Microchip USA

USA . 2,299 parts In-Stock

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Corphita

USA . 1,866 parts In-Stock

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Northwest PG Solutions

USA . 1,816 parts In-Stock

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$5.459

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1,816

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$5.459

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Overview

Elevate your electronic designs with the DIX4192IPFBRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability. This line driver and receiver offers seamless integration into various applications, providing unparalleled value to customers. With its advanced technology and industrial-grade performance, this product delivers outstanding benefits and advantages. Experience enhanced functionality and efficiency with the DIX4192IPFBRG4 - your ultimate solution for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the product.

Surface Mount: YES

Surface mount installation allows for easy and efficient integration into electronic circuit boards.

Maximum Supply Voltage: 1.95 V

Low maximum supply voltage helps in reducing power consumption and extending the product's lifespan.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance output state, enhancing flexibility and compatibility with various systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product reliable and energy-efficient.

Technical Specifications

Line Drivers & Receivers DIX4192IPFBRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.000025 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

DIX4192IPFBRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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