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DCV010505P-U/700E4

Texas Instruments

DCV010505P-U/700E4 by Texas Instruments

DCV010505P-U/700E4 by Texas Instruments is a small outline power supply module with 7 terminals. It operates b/w -40 to 85°C, offering an output voltage range of 4.75-5.25 V ideal for industrial applications requiring unregulated DC-DC conversion with a max load regulation of 31%.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,305 parts In-Stock

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Digiode

USA . 759 parts In-Stock

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Nova Conductors

Japan . 32 parts In-Stock

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One Stop Electronics

USA . 1,332 parts In-Stock

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$2.500

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Ampacity Inc.

Singapore . 689 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 227 parts In-Stock

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$8.490

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Parana Technologies

USA . 1,776 parts In-Stock

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$18.162

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$18.304

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DigiPath Technology Company

USA . 1,971 parts In-Stock

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$19.999

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$18.399

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ChromeModa Solutions

Germany . 1,094 parts In-Stock

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$20.407

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$16.734

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IDEA Electronic Components Group

UK . 869 parts In-Stock

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$20.407

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$19.387

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$18.366

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Corphita

USA . 1,283 parts In-Stock

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Argo Parts USA

USA . 1,144 parts In-Stock

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Power up your applications with the DCV010505P-U/700E4 by Texas Instruments. As a leader in power supply modules, Texas Instruments delivers top-notch quality and reliability. Designed for industrial-grade performance, this small outline module offers a nominal output voltage of 5V with excellent load regulation. With a compact size and surface-mount capability, this module is perfect for a wide range of electronic devices. Trust Texas Instruments to provide the power solutions you need for optimal performance and efficiency. Experience the difference with the DCV010505P-U/700E4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the power supply module, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable makes installation easy and efficient, saving time and effort during the assembly process.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the power supply module to operate in various environments, making it versatile and suitable for different applications.

Maximum Total Power Output: 1 W

Despite its compact size, the power supply module can deliver a maximum power output of 1W, making it suitable for powering a range of electronic devices.

Technology: BCDMOS

Utilizing BCDMOS technology ensures efficient power conversion and regulation, resulting in reliable performance and energy savings.

Technical Specifications

Power Supply Modules DCV010505P-U/700E4 attributes and parameters. Explore more Power Supply Modules devices from Texas Instruments

Specs

Additional Features:

SHORT-CIRCUIT PROTECTION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDSO-G7

JESD-609 Code:

e4

Length:

19.18 mm

Maximum Load Regulation:

31 %

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

7

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

5.25 V

Minimum Output Voltage:

4.75 V

Nominal Output Voltage:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

GWDIP7/14,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Sub-Category:

Other Analog ICs

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Total Power Output:

1 W

Trim or Adjustable Output (V):

NO

Width (mm):

6.604 mm

Trade Compliance

DCV010505P-U/700E4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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