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DCV010512DP

Texas Instruments

DCV010512DP by Texas Instruments

DC-DC UNREGULATED POWER SUPPLY MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 7; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;

Median Price

$16.300

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,750 parts In-Stock

1+ parts

$12.865

100+ parts

$11.238

1k+ parts

$7.750

10k+ parts

-

5,750

$12.865

$11.238

$7.750

-

Mouser Electronics

USA . 75 parts In-Stock

1+ parts

$18.040

100+ parts

$15.760

1k+ parts

$15.650

10k+ parts

-

75

$18.040

$15.760

$15.650

-

Rochester

USA . 717 parts In-Stock

1+ parts

-

100+ parts

$13.040

1k+ parts

$11.670

10k+ parts

$10.980

717

-

$13.040

$11.670

$10.980

Verical

USA . 717 parts In-Stock

1+ parts

-

100+ parts

$16.300

1k+ parts

$14.588

10k+ parts

$13.725

717

-

$16.300

$14.588

$13.725

DigiKey

USA . 48 parts In-Stock

1+ parts

-

100+ parts

$17.160

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48

-

$17.160

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Distributors (In-Stock)

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Digiode

USA . 3,546 parts In-Stock

1+ parts

$10.222

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-

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-

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3,546

$10.222

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Vyrian

USA . 2,934 parts In-Stock

1+ parts

$10.760

100+ parts

-

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-

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2,934

$10.760

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DigiKey Marketplace

USA . 48 parts In-Stock

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48

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Prism Electronics

USA . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,591 parts In-Stock

1+ parts

$9.684

100+ parts

-

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-

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2,591

$9.684

-

-

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Parana Technologies

USA . 200 parts In-Stock

1+ parts

$19.657

100+ parts

-

1k+ parts

$19.649

10k+ parts

-

200

$19.657

-

$19.649

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ChromeModa Solutions

Germany . 4,894 parts In-Stock

1+ parts

$22.087

100+ parts

$18.111

1k+ parts

-

10k+ parts

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4,894

$22.087

$18.111

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IDEA Electronic Components Group

UK . 1,720 parts In-Stock

1+ parts

$22.087

100+ parts

$20.983

1k+ parts

$19.878

10k+ parts

-

1,720

$22.087

$20.983

$19.878

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Lixinc

USA . 14,445 parts In-Stock

1+ parts

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14,445

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A-Z Elektronik GmbH

Germany . 5,538 parts In-Stock

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5,538

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Alle Elektronik GmbH

Germany . 3,692 parts In-Stock

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3,692

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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DigiPath Technology Company

USA . 1,401 parts In-Stock

1+ parts

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$19.914

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1,401

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$19.914

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Native Components

USA . 463 parts In-Stock

1+ parts

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463

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Northwest PG Solutions

USA . 385 parts In-Stock

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385

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Perfect Parts

USA . 155 parts In-Stock

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155

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Technical Specifications

Power Supply Modules DCV010512DP attributes and parameters. Explore more Power Supply Modules devices from Texas Instruments

Specs

Additional Features:

ADDITIONAL -12 V OUTPUT AVAILABLE

Approvals (V):

UL

Control Mode:

VOLTAGE-MODE

Main Output Efficiency:

82 %

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDIP-T7

JESD-609 Code:

e4

Length:

19.18 mm

Maximum Load Regulation:

37 %

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

7

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.041 A

Maximum Output Voltage:

12.6 V

Minimum Output Voltage:

11.4 V

Nominal Output Voltage:

12 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP7/14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Protection(s):

THERMAL

Qualification:

Not Qualified

Main Out Ripple Voltage:

.007 Vrms

Maximum Seated Height:

5.33 mm

Sub-Category:

Other Analog ICs

Surface Mount:

NO

Switcher Config:

PUSH-PULL

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Total Power Output:

1 W

Trim or Adjustable Output (V):

NO

Width (mm):

7.62 mm

Trade Compliance

DCV010512DP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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